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FCCSP (Flip Chip-Chip Scale Package) Substrate

Semiconductor builds solder on bump side, and then mounts on Flip Chip substrate.



Application
Features
  • Application processor
  • Networking
  • Connectivity
  • High I/O, High accuracy, Low profile

Reliability

Item Condition/Duration
MSL JEDEC Level 3, 30°C/60%RH, 192 hours
PCT 121°C/100% RH/2 atm, 168 hours
TCT -65°C ~150°C, 1000 cycles
HAST 130°C /85%RH/33.5 PSIA, 96 hours
HTST 150, 1000 hours