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System-in-Package (SiP)

Heterogeneous integration of increasingly smaller devices packaged with higher functionality

The semiconductor industry is facing a new era in which device scaling and cost reduction will no longer continue on the path followed for the past few decades. Semiconductor companies are now looking for technology solutions to bridge the gap and improve cost-performance, while adding more functionality through integration. Integrating all functions into one single chip (SoC) presents many challenges that include higher costs and design complexities. An attractive alternative is heterogeneous integration that uses advanced packaging technology to integrate devices, which can be separately designed and manufactured by the most suitable process technology in the most optimized way. System-in-Package (SiP) technology is the key enabler for future heterogeneous integration (HI) demands.

What is System-in-Package (SiP)?

ASE defines SiP as a package or module that contains a functional electronic system or subsystem that is integrated and miniaturized through IC assembly technologies. Rather than generic IC packaging technologies, development of SiP requires heterogeneous integration of single or multiple chips (such as a specialized processor, DRAM, flash memory), surface mount device (SMD) resistor/capacitor/inductor, filters, connectors, MEMS device, sensors, other active/passive components and pre-assembled package or subsystem.

Enabling Technologies

ASE’s SiP solutions leverage upon established IC assembly capabilities including copper wiring, flip chip packaging, wafer level packaging, fan-out wafer level packaging, 2.5D/3D IC and embedded chip packaging to address ongoing trends in mobile, IoT (Internet of Things), high performance computing, automotive, and artificial intelligence.

ASE SiP Technologies

Shielding
Conformal Shielding
Compartment Shielding
• Selective Shielding
• Magnetic shielding

Antenna
Antenna on Package
• Antenna in Package

Encapsulation
Double Side Molding
Selective Molding
Flexible Encapsulation
• Molded Underfill
• Irregular Packaging

Board Assembly
High Density SMT
• ACF Bonding
• Wire Bond on Flex
• Laser Welding
• Flex Bending

ASE SiP Technologies (continued)

Interconnection
• Cap Wire Bond
• Wire Bond
Flip Chip

Die / Package Stacking
2.5D
• Die Thinning/Stacking
Package on Package
Package in Package

Wafer Level Package
Wafer Bumping
Cu Pillar
Fan-out WLP
Wafer Level IPD
Wafer Level MEMS

Embedded Substrate
SESUB
a-EASI

Turnkey Solution

ASE offers customers complete SiP manufacturing capability including system design, software development, module testing and electrical heat transfer simulation technology to enable smaller, higher performance, lower power consumption and more cost effective end products.

System Co-Design
• SiP Electronic Design Automation (EDA) solution
• RF Circuit design
• Antenna Design
• Shielding Solution
• Substrate Layout design

Packaging Consultancy
• Package selection & configuration
• Design rule guideline
• Process capability
• Reliability verification

System Test Consultancy
• RF Wafer probing
• RF ATE Platform
• EVB design & fabrication
• Testing tooling design
• Final test solution development

System-in-Package Applications

SiP solutions are highly adopted by end customers for applications including wireless communication, computer storage, power and sensor. In addition, ASE SiP solutions enable a wide range of smart applications including smart living, smart bike, smart city and smart automotive. Advanced SMT, encapsulation, shielding as well as interconnection assembly technologies are developed to meet future requirement arised from 5G communication, AR/VR sensing, and health caring applications.

Conformal Shielding

ASE had introduced a novel conformal shielding technology (CFS) for electromagnetic interference (EMI) prevention, against external interference, keep chip normal working. For thinner, smaller and lighter product, PVD CFS technology was designed to substitute for metal can/lid. The technology was widely applied in wireless communication, ex: RF, Bluetooth, WiFi, etc.

Application

  • Phone/Tablet
  • Wearable Device
  • Glasses
  • Camera
  • Car System

Features

CPS technology was prevented package to package and outer signal interference. Developed advanced PVD process replaced metal can/lid to reach product miniaturization, area reduction 17% and thickness reduction 7%.

Capabilities

ASE developed PVD CFS technology was reached over 99.9% (SE value > 30dB) EMI impact in 0.5 to 6GHz frequency when metal layer thickness over 3um.

Compartment Shielding

ASE had introduced a new, EMI compartment shielding (CPS) structure which was constructed from laser trench and conductive paste. The technology is designed to provide better shielding performance in more compact structure. The distinctive characteristics of CPS technology (Laser trench/Conductive paste filling) are flexible and customized design for high-integration module. This offers customers much more aggressive layout design, and also high-level EMI shielding performance for sensitive components/chipset. In addition, CPS technology enables the smaller form factor of modules which is needs of wearable device, mobile device, and IoT application.

Application

  • Phone/Tablet
  • Wearable Device
  • Glasses
  • Camera
  • Car System

Features

  • Higher EMI shielding performance
  • Highly flexible and customized shielding pattern design
  • Thinner, compact shielding barrier (~150um)
  • Mold base compartment shielding solution

Capabilities

Structure:

  • Trench opening width (top/bottom): 400um/80um
  • Shielding performance (S.E.): 45~50dB (1GHz – 6GHz)

Antenna on Package

Antenna on Package (AoP) is a new approach to minimize the antenna size at the package level, which not only can provide the smallest antenna, but also a highly integrated RF SiP module to reduce the difficulty at the system level.

Application

AoP technology allows much more applications in mobile device and wireless communication, such as 2.4GHz BLE in BT4.2 and future BT5.0, WiHD in IEEE 802.15.3c, WiGig in IEEE 802.11ad. In addition, AoP technology enables the advanced 3D patterning on package that addresses the need in the challenging 77GHz for car radar and 94GHz for imaging.

Features

AoP technology is designed to provide a good radiation performance with the low insertion loss and good impedance matching between the RF SiP and the antenna. Base on a completed material and process database system in ASE, the electromagnetic simulation can be performed for different customer requested conditions. The key to realize the optimum design into a successful AoP product is through the powerful 3D patterning ability on a conformal and good quality metal film.

Capabilities

ASE concentrates on advanced 3D patterning developing with high accuracy control and high automation throughput and these unique capabilities include:

  • Min. package size: 4.9mm x 3.3mm (achieved at 2.4GHz)
  • Film step coverage: >30%
  • Min. line/space on top: 250μm
  • Dimension tolerance on side wall: within +/-35um

Double Side Molding

ASE provides an advanced module encapsulation technology, called the double-side molded module technology. It solves the old single-sided molded technology in the back of the region only the electrical connection of the waste space, thereby achieving the purpose of module miniaturization.

Application

Miniaturization module especially in WiFi and RF.

Features

Both sides of the substrate are molded with PMC, in the back central area of the placement and around the use of substrate interposer for electrical connection, ultimately connected to the motherboard IPAD using Film mold technology.

Capabilities

  • Size saving: 10 ~ 40 %
  • Pad Pitch: >= 0.4mm
  • MUF capability is the same single side molded

Module Level
Pre-con (L3) TCT-1000 HAST-264 HTST-1000
Passed Passed Passed Passed
Board Level
Drop Test Function
Passed Passed

Selective Molding

ASE provides an advanced module encapsulation technology, called the selective molded module technology. It can solve the sensitivity components cannot put in over molded issue, but also allows the end product space design has greater flexibility.

Application

Miniaturization module especially in WiFi and RF.

Features

On the same side of the substrate, there are both an mold area and a open area.

Capabilities

  • Clearance of open area: > 0.3mm
  • Clamp width between mold area and open area: > 0.6mm
  • Clamp width between open area and package side line: > 0.6mm

Module Level
Pre-con (L3) TCT-1000 HAST-264 HTST-1000
Passed Passed Passed Passed
Board Level
Drop Test Function
Passed Passed

High Density SMT

The ways to reduce form factor of SiP in X/Y size are utilization of tiny passive components and shrinking distance between components to component. ASE HD-SMT technology by using tiny 01005 SMD and 3 mils component to component distance is ready and in mass production.

To expand more functions in restricted body size of a SiP/module, dual side SMT as well as double sides molding technology is adopted.

Application

  • Phone/Tablet
  • DWearable Device
  • DGlasses, Camera
  • DIoT/Smart Home Electronics
  • DCar System

Features

  • One side or dual side SMT
  • Ultra-high accuracy pick & place
  • Ultra-high SPI & AOI for yield insurances

Capabilities

  • 01005 component MP, 008004 ready
  • 6-layer 0.185mm substrate in mass production
  • Minimum 3 mils component to component distance

Flexible Encapsulation

ASE provides an advanced encapsulation technology, called the flexible encapsulation technology. It enhances the wearable products in the waterproof function: products can still be bent after encapsulation.

Application

Wearable electrical product including clothes, glasses, watches, bracelets, and rings.

Features

This technology uses a special flexible sealant material with a soft board (FPC) so that the module can be bending in the end product after module assembly.

Capabilities

Test Item Test Condition Duration Results
TCT -55°C~85°C 100 cycles Passed
Bending 30°C 100 cycles Passed
Twist twist span 45mm, angle 5~30 degrees 100 cycles Passed