Visit from Minister Lee Ying-Yuan, Environmental Protection Administration, Executive Yuan, ROC (Taiwan) to ASE Kaohsiung’s Water Recycling Plant
Kaohsiung, Taiwan, October 25, 2016 - ien Wu, COO, ASE Group and Raymond Lo, General Manager, ASE Kaohsiung hosted the visit of Minister Lee Ying-Yuan and his entourage at the ASE campus in Nantze Export Processing Zone (NEPZ) today.
The ASE management team briefed the visiting officials on ASE’s water management and environmental control processes. The group then proceeded for a tour of the K14 wastewater processing and recycling plant.
At the end of the visit, Minister Lee commended ASE on the efforts and progress that the company has made in environmental sustainability since the 2013 K7 wastewater incident. Following the incident, ASE has taken the opportunity to further strengthen its internal infrastructures and policies in the management of environmental issues including wastewater discharge processes. In April 2015, ASE began operating Taiwan’s largest state of the art wastewater processing and recycling plant at the NEPZ in Kaohsiung.
As the leading company in semiconductor assembly and test manufacturing, ASE not only takes pride in its water resource management, but also in its efforts to construct environmentally friendly buildings that are energy efficient, and are safe and healthy workplaces for its employees. From 2009, ASE embarked on green building programs to ensure that new properties are built according to international green standards while existing ones are refurbished. Today ASE has a total of 12 buildings that have received US LEED (Leadership in Energy & Environmental Design) go ld certifications.
About The ASE Group
The ASE Group is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through USI Inc and its subsidiaries, members of the ASE Group. For more information about the ASE Group, visit www.aseglobal.com or twitter @asegroup_global.