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Solution Platform

The ASE heterogeneous integration team possess many years of industry-leading experience in packaging and SiP technology development. ASE SiP technology enables ultra-compact, high capacity, low power module solutions with controller and sensor integration to meet the application needs of AI, IoT and mobile device miniaturization. The company has also developed various business models to actively promote the SiP eco-system. ASE’s innovative SiP and MEMS solutions leverage upon established IC assembly capabilities including copper wiring, flip chip packaging, wafer level packaging, fan-out wafer level packaging, 2.5D/3D IC and embedded chip packaging to address ongoing trends for the mobile device, IoT, high performance computing, and IoV (Internet of Vehicles) markets.