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Smart Automotive

Smart automotive enables a comfortable and convenient driving experience with intelligent and carbon-reducing by integrating AI, communication, and entertainment. Semiconductor manufacturers integrates packaging technologies with sensors such as image sensor, environment sensors, and controllers to manufacture various IC s with high standard of safety for realizing various functions that smart automotive required. ASE provides comprehensive one-stop manufacturing services from wafers to packages to modules, a turnkey solution for rapid time-to-market and cost effectiveness. Long-term partnered with global automotive tier-one suppliers and qualified with TS16949, ISO26262 certification, ASE is able to provide complete packaging solution for next generation automotive applications with high reliability, integration and efficiency.

  • Airbag Control Module
  • Airbag Crash Sensors
  • Event Data Recorder

  • Leadframe

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • ADAS Control Module
  • Camera Modules
  • Sensor Modules
  • V2X Communications

  • Leadframe

  • Wire Bond

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Climate Control
  • Remote Keyless Entry System
  • Lighting
  • Electronic Control Units

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Audio Head Units
  • Fixed Navigation Systems
  • Infotainment Head Units
  • Rear Seat Entertainment

  • Leadframe

  • Wire Bond

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced
  • Antilock Braking System (ABS)
  • Stability Control
  • Tire Pressure Monitoring
  • Steer/Brake-by-wire

  • Leadframe

  • Wire Bond

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Electric Drive Controller
  • Battery Management
  • Inverter

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU

  • IGBT+Coupler
  • Instrument Cluster
  • Head-up Display

  • Wire Bond

  • Wafer Level

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced
  • Engine Control Module
  • Transmission Control Module

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Portable Navigation Devices
  • Audio Head Units
  • Infotainment Head Units
  • Video Recorders

  • Leadframe

  • Wire Bond

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced