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Smart Automotive

Smart automotive enables a comfortable and convenient driving experience with intelligent and carbon-reducing by integrating AI, communication, and entertainment. Semiconductor manufacturers integrates packaging technologies with sensors such as image sensor, environment sensors, and controllers to manufacture various IC s with high standard of safety for realizing various functions that smart automotive required. ASE provides comprehensive one-stop manufacturing services from wafers to packages to modules, a turnkey solution for rapid time-to-market and cost effectiveness. Long-term partnered with global automotive tier-one suppliers and qualified with TS16949, ISO26262 certification, ASE is able to provide complete packaging solution for next generation automotive applications with high reliability, integration and efficiency.

Smart Automotive

Smart automotive enables a comfortable and convenient driving experience with intelligent and carbon-reducing by integrating AI, communication, and entertainment. Semiconductor manufacturers integrates packaging technologies with sensors such as image sensor, environment sensor, and controller to manufacture various IC's with high standard of safety for realizing various functions that smart automotive required. ASE provides comprehensive one-stop manufacturing services from wafers to packages to modules, a turnkey solution for rapid time-to-market and cost effectiveness. Long-term partnered with global automotive tier-one suppliers and qualified with TS16949, ISO26262 certification, ASE is able to provide complete packaging solution for next generation automotive applications with high reliability, integration, and efficiency.

  • Airbag Control Module
  • Airbag Crash Sensors
  • Event Data Recorder

  • Leadframe

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • ADAS Control Module
  • Camera Modules
  • Sensor Modules
  • V2X Communications

  • Leadframe

  • Wire Bond

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Climate Control
  • Remote Keyless Entry System
  • Lighting
  • Electronic Control Units

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Audio Head Units
  • Fixed Navigation Systems
  • Infotainment Head Units
  • Rear Seat Entertainment

  • Leadframe

  • Wire Bond

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced
  • Antilock Braking System (ABS)
  • Stability Control
  • Tire Pressure Monitoring
  • Steer/Brake-by-wire

  • Leadframe

  • Wire Bond

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Electric Drive Controller
  • Battery Management
  • Inverter

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU

  • IGBT+Coupler
  • Instrument Cluster
  • Head-up Display

  • Wire Bond

  • Wafer Level

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced
  • Engine Control Module
  • Transmission Control Module

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Portable Navigation Devices
  • Audio Head Units
  • Infotainment Head Units
  • Video Recorders

  • Leadframe

  • Wire Bond

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced