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Milestones

2018
  • On April 30, ASE Industrial Holding was listed on the Taiwan Stock Exchange (TWSE code: 3711) and whose American depositary shares listed on the New York Stock Exchange (NYSE code: ASX).
  • On February 12, ASE and SPIL announced on interim shareholders meeting that under the joint share exchange agreement, ASE Industrial Holding would be established that would hold 100% of the equity interests of both ASE and SPIL.
2016
  • In June, ASE and SPIL jointly announced that each party’s respective board of directors has adopted resolution to approve the entering into and execution of a joint share exchange agreement between ASE and SPIL and agreement to establish a new holding company.
2015
  • ASE and TDK established the ASE Embedded Electronics Inc at Kaohsiung, Taiwan to offer SESUB® (semiconductor embedded in substrate) module technology that enables semiconductor miniaturization for portable and wearable electronic devices.
  • In October, the ASE water recycling plant began operations at the Kaohsiung Nantze Export Processing Zone.


2014
  • Celebrated the ASE Group's 30th anniversary.


2013
  • Acquired Wuxi Tongzhi Microelectronics Co, Ltd from Toshiba to expand ASE's IC assembly and testing service offerings in China.


2012
  • Universal Scientific Shanghai, a subsidiary of Universal Scientific Co. Ltd., completed its IPO on the Shanghai Stock Exchange on February 2012.
  • ASE Korea and the city of Paju signed an MOU for the further development of ASE's communication IC packaging and testing production facilites in the industrial zone.


2011
  • Operation began at ASE K12, the world’s first semiconductor assembly and test facility to be awarded the double distinction of EEWH Diamond and LEED Platinum certifications.


2010
  • Acquired EEMS Test Singapore Pte Ltd to further strengthen ASE Singapore's test offerings.
  • Acquired Universal Scientific Industrial Co, Ltd to provide a complete IC manufacturing service portfolio from chip-level assembly and testing to board-level PCB/module assembly.
  • ASE Kunshan officially in operation. The strategically located facility at the Yanhu Industrial Park, Kunshan, Jiangsu province provides assembly, test, substrate and board assembly manufacturing capabilities.


2009
  • Started volume production of Copper Wire Bonding at ASE manufacturing sites.


2008
  • Acquired Aimhigh's manufacturing facility located in Wei Hai city, Shandong, China specializing in discrete IC packaging.



2007
  • ASEN, an IC assembly and testing facility was jointly established by ASE and NXP in Suzhou, China.
  • Integrated GAPT Shanghai into the ASE Group and renamed ASE Assembly & Test (Shanghai) Ltd.


2006
  • Transferred existing semiconductor material business department to its wholly owned subsidiary, ASE Electronics Inc., to strengthen core competencies and to further develop material business.
  • ASE and Powerchip formed joint venture to establish PowerASE Technology Inc, focusing on packaging and test services for the memory IC market.


2005
  • Started volume production of Wafer Level CSP (WLCSP).
2004
  • Acquired NEC Electronics' IC packaging and testing operation in Takahata, Japan. The acquisition enabled ASE to enhance its presence and market share with Japanese IDM (Integrated Device Manufacturers) customers.
  • Established substrate and IC module manufacturing facilities in Shanghai, China.
  • ASE IC Assembly, Test and Materials surpassed all players in the OSAT industry to achieve global market leadership.
  • Celebrated the ASE Group’s 20th anniversary.


2003
  • Combined subsidiaries ASE (Chung Li) Inc. and ASE Material Inc., setting an efficient and effective standard for overall resource utility.
  • In a joint venture with Compeq Manufacturing Co., Ltd., Taiwan's largest substrate manufacturing service supplier, the company formed ASE-Compeq Technologies Inc. specialized in IC substrate to further reinforce the capability of substrate design and manufacturing.


2001
  • Established ASE ChungLi Intelligent Industrial Park to provide comprehensive turnkey services under one roof in Northern Taiwan.
  • Completed development and opened facility to handle 300mm wafer bumping.


2000
  • ASE Inc. started trading on the New York Stock Exchange through the issue of ADR.
  • Commenced volume production of flip chip packaging.


1999
  • ASE Test Limited listed on NASDAQ, becoming the first Taiwan-based company to make a public offering in the US.
  • Acquired Motorola's manufacturing facilities in Chungli, Taiwan and Paju, Korea.
  • Obtained controlling interest in Universal Scientific Industrial Co., Ltd. (USI), expanding into the scope of systems assembly.


1998
  • ASE Test Limited started trading on Taiwan Stock Exchange through the issue of TDR.
  • Established in-house flip chip assembly and test capabilities.


1996
  • Incorporated ASE Material Inc. to establish in-house inter-connection materials (substrates) capabilities.


1991
  • Established packaging and testing facilities in Penang, Malaysia.


1990
  • Entered the semiconductor test market by acquiring ASE Test Limited.


1989
  • ASE Inc began trading on the Taiwan Stock Exchange.
1984
  • Brothers Jason Chang and Richard Chang established Advanced Semiconductor Engineering, Inc. Operations began at its first factory in Kaohsiung, Taiwan.