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Test Service Offerings

Exhaustive Range of Testing Service

ASE provides a complete range of semiconductor testing services to our customers, including front-end engineering testing, wafer probing, final testing of logic, mixed signal, System-in-Package (Module), RF, and memory, and other test-related services. Our testing services employ technology and expertise that are among the most advanced in the semiconductor industry.

Customer Orientation

In front-end engineering testing services, we help customers develop customized test solution to test their semiconductors on advanced test equipment.
In addition, we also perform the following services:
  • Electrical verification to assess whether a semiconductor device complies with a variety of different operating specifications.
  • Reliability analysis to assess the long-term reliability of the semiconductor and its suitability of use for intended applications.
  • Failure analysis when a semiconductor device does not function to specifications during either the electrical verification or reliability testing processes.

Test Engineering Capability

In test solution development services, we provide customers to develop customized test solution to test their semiconductors on advanced test equipment.
Besides, we also fulfill the following services,
  • We carry out visual inspection and electrical testing of processed wafers to ensure that they meet our customers' specifications.
  • In the final testing of logic, mixed signal, memory, and RF semiconductors, we test devices with leads ranging from the single digits to several hundreds and operating frequencies up to several gigahertzes on test equipment from major international manufacturers.

Wafer Sort Experience Overview

In wafer sort, we carry out visual inspection and electrical testing of processed wafers to ensure that they meet our customers' specifications. We probe devices with pins number from ten thousands to multi-site of hundreds, wafer size ranging from 6 to 12 inches, probe card types of micro-spring, vertical prober card, cantilever prober card, membrane, etc. Temperature ranges from -40 to 125℃ and experienced in digital, analog, RF, automotive devices wafer sort. ASE provides the services of WLP singulated re-screen process and test solution development including test program coding and probe card design & fabrication.

Wafer Sort:

  • Wafer sort coding
  • Probing card fabrication
  • Debugging
  • Correlation & release

Final Test Experience Overview

In the final testing of logic, mixed signal and RF semiconductors, we test devices with leads ranging from the single digits to several hundreds and operating frequencies up to several gigahertzes on test equipment from major international manufacturers. We have, by far, the largest installed base of test equipment among independent service providers.

In FT test solution development, we provide the solution services including test program development of digital, analog, RF, automotive devices, load board design & fabrication, handler change kit, socket design & fabrication, etc.

We also provide a range of additional test-related services, including burn-in testing, system level testing, visual inspection, singulated top marking, dry pack, and tape & reel.

Final Test:

  • Wafer sort coding
  • Probing card fabrication
  • Debugging
  • Correlation & release

We implement the automatic production starting from pre-test to product delivery and equipment management.

Singulated Re-Screen Process

ASET created the Singulated Re-Screen Process to rework the singulated die in tape-reel if customers need to re-probe the die. Singulated Re-Screen process could reprocess the WLCSP die packed in tape & reel. The reprocess starts from de-tape, reconfigure singluated die in film frame, singluated die probing, pick & place to tape & reel. The probe card is the same as production so that no new probe card is required.

ASE planned to build up the talents through the programs of OJT (On Job Training), outside & inside training, and coaching.