To stay ahead of the semiconductor technology curve, ASE maintains a highly experienced and skilled engineering team that continuously research and develop the very latest in assembly technologies. Within the industry, we have achieved leadership and volume production in advanced package processes, such as for Cu Wire Bonding, Wafer Bumping, Cu Pillar Bump, Flip Chip, Chip Scale Package (CSP), PoP, System in Package (SiP), MEMS & Sensor Packaging, Fan Out, 2.5D/3D IC Packaging, and Green Packaging. Our customers are the direct beneficiaries of our dedication and commitment to the development of advanced technologies.
Listening to our customers and investing to capture market transition gives ASE the strong competitive advantage required to develop innovative solutions, which meet customer needs and drive growth.
Strategic investment in the latest equipment and state-of-the-art facilities truly makes ASE a solid and reliable extension of our customers’ manufacturing operations.