Selective Molding

ASE provides an advanced module encapsulation technology, called the selective molded module technology. It can solve the sensitivity components cannot put in over molded issue, but also allows the end product space design has greater flexibility.

Application

Miniaturization module especially in WiFi and RF.

Features

On the same side of the substrate, there are both an mold area and a open area.

Capabilities

Module Level
Pre-con (L3) TCT-1000 HAST-264 HTST-1000
Passed Passed Passed Passed
Board Level
Drop Test Function
Passed Passed