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As the increasingly demand of computer, communication and consumer electronics in recent years, flip-chip ball grid array (FCBGA) with ajinomoto build-up film (ABF) substrate is major package for performance request. But if we consider performance, substrate resource, and cost, alternative package structure is need to replace FCBGA. Hence, two alternative… Read More
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This work discusses that the manufacturing tolerances and material characteristic of 4+2+4 multi-layer substrate impact on performance of Millimeter-wave (mmWave) antenna-in/on-package (AiP/AoP). The designed test kits to extract the material characteristic of multi-layer substrate including T-resonator, microstrip transmission line, and microstrip patch antenna. The stacking patch antenna implemented on 4+2+4… Read More
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In this paper, we present a dual-band (28/39GHz) 2 by 2 antenna array design on a 10 (4+2+4) multi-layer organic substrate bringing broad bandwidth and higher isolation onto a compact AiP module. The antenna structure is a stacking patch antenna with multi-parasitic elements to improve bandwidth. This proposed H-type slot… Read More
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In order to ensure the performance of high-frequency fan-out package design, especially at mmWave application, the influence of substrate dielectric characteristic is very serious. Polyimide (PI) material is common material used in Fan-out package. The moisture effect of PI is very obvious in stress and electrical performance. Sso this paper… Read More
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This paper discusses a 2×2 broadband dual-polarized antenna array on the 4+2+4 cost-effective multilayer organic substrates with size of 13 x 13 x 0.87 mm 3 . Each antenna element consists of one driven patch, one stacked patch, and four parasitic elements. This work focuses on simulating and analyzing the effect of… Read More
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System-in-package (SiP) modules are widely used in portable electronics such as Internet of Things (IoT) devices and mobile consumer equipment since they integrate multiple components in a single package and thus facilitate device miniaturization. An advanced packaging technology referred to as dual-side molding (DSM) has recently been proposed as… Read More
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The Fifth and Sixth Generation wireless strong demands driving IC-Package development into a newly formed in higher performance, more heterogeneous integration towards commercialization, Commercialization needs an advanced fabrication platform (e.g. Panel Level Platform, PL). The promising PL IC-Package technology on outsourced semiconductor assembly/testing provides the right solution. We have successfully… Read More
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IoT envisions connection of trillions of devices around the world to data centers, and enables applications with the network connected. Nevertheless, SiP opportunities stay with two fundamental requests: miniaturization benefits and valuable market size. These are by no means for comprehensive listing of the IoT devices that will be deployed… Read More
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The electrification trend for the automotive industry (electric- and hybrid electric vehicles EV/HEV) desires the development of application specific power modules with shorter time-to-market for which the reliability is guaranteed over a large time span. Besides the electrical layout of such power modules, numerous variations of the design can be… Read More