This is posts with tag name "mmWave AiP/AoP"

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Performance Analysis and Impact of Manufacturing Tolerances of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM)

This work discusses that the manufacturing tolerances and material characteristic of 4+2+4 multi-layer substrate impact on performance of Millimeter-wave (mmWave) antenna-in/on-package (AiP/AoP). The designed test kits to extract the material characteristic of multi-layer substrate including T-resonator, microstrip transmission line, and microstrip patch antenna. The stacking patch antenna implemented on 4+2+4… Read More

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Design of Dual-Band (28/39GHz) Antenna-in-Package with broad bandwidth for 5G Millimeter-Wave Application

In this paper, we present a dual-band (28/39GHz) 2 by 2 antenna array design on a 10 (4+2+4) multi-layer organic substrate bringing broad bandwidth and higher isolation onto a compact AiP module. The antenna structure is a stacking patch antenna with multi-parasitic elements to improve bandwidth. This proposed H-type slot… Read More

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Broadband Dual-Polarized Antenna Array using AiP Techniques for 5G mmWave Beamforming Systems

This paper discusses a 2×2 broadband dual-polarized antenna array on the 4+2+4 cost-effective multilayer organic substrates with size of 13 x 13 x 0.87 mm 3 . Each antenna element consists of one driven patch, one stacked patch, and four parasitic elements. This work focuses on simulating and analyzing the effect of… Read More