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Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale Packages
The Sn-4Ag-0.5Cu base solder adding 3 wt.% bismuth (SAC-3Bi) solder has better drop and thermal cycling performance than Sn-4Ag-0.5Cu solder due the excellent mechanical properties in previous study. Therefore, SAC-3Bi has applied in solder joints of wafer level chip scale packaging (WLCSP) in recent year. In this study, SAC-3Bi solder… Read More
