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Flip Chip BGA

Flip Chip Organic BGA
Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA package especially in high frequency applications.

Flip Chip Ceramic BGA
Alumina ceramic substrate offers better moisture resistance, electrical insulating property and higher thermal conductivity than organic substrate. FCBGA is used primarily for high-reliability commercial applications (e.g. CPU).

Application
Features
Consumer
  • Graphics/Chipsets for PC
  • Server
  • Game Console and High-end Application
  • Microprocessor for PC & Server
  • Memory
Telecommunications
  • Network Products (LAN)
  • Switching
  • Transmission
  • Cellular Base Stations

Substrate
4 layer laminate, 4~12 layer & 800/400 um Build-up substrates, and ceramic substrates are available for different application
Passive Component
Passive component attaching is available. It can be placed on the top or bottom side of the package
Ceramic BGA
High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages

HFC BGA (High Performance FCBGA), a thermally enhanced FCBGA, is the composite package of FCBGA with heatspreader made of Cu, Al, or AlSiC. The heatspreader is used to extend the heat conduction area by connecting itself to the rear side of the silicon chip.

This method desensitizes the performance deviation out of the chip size, lowers the thermal resistance of junction-to-case (θJC) and enables the external heat sink or fan to work more effectively. HFCBGA can produce 6~8 watts of power dissipation under natural convection.

Application
Features
Consumer
  • Graphics/Chipsets for PC
  • Server and High-end Application
  • Microprocessor for PC & Server
Telecommunications
  • Network Products (eg. LAN)
  • Switching
  • Transmission
  • Cellular Base Stations

Substrate
4 layer laminate, 4~12 layer build-up, ceramic, and PTFE substrates are available
Thermal Lids
Heat spreaders made of Cu with Ni plating, Aluminum, Ceramic, AlSiC
Passive Component
Passive component attaching. It can be placed on the top or bottom side of the package
Ceramic BGA
High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages

FOCoS stands for Fan Out Chips on Substrate. The biggest advantage of FOCoS packages is to achieve Homogeneous and Heterogeneous chip integration. It is able to integrate two chips from different wafers.

Application
Features
  • Mobile Phone: Baseband, RF, Codec, PMICs
  • Tablet
  • Networking, Server
  • Car Radar
  • Small form factor, low power consumption, high performance, cost reduction
  • 3 layers RDLs approached
  • 2 active die (D2D)
  • Improved electrical and thermal performance
  • Excellent warpage control
  • Substrate-less

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