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aQFN

Advanced Quad Flat No-lead. aQFN™ is solution for Lead less, multi-row and fine pitch lead frame package with enhanced Thermal/ Electrical performance. aQFN™ is a cost-effective packaging solution due to its economical materials and simpler packaging process.


Application
Features

Telecommunication Products
• Cellular Phones
• Wireless LAN

Portable Products
• Personal Digital Assistants
• Digital Cameras

Low to Medium Lead Count Packages
• Information Appliances

  • Low profile, small footprint and light weight
  • Free-form I/O design
  • Fine lead pitch 0.4mm
  • Excellent thermal performance
  • Excellent electrical performance
  • Good SMT performance
  • Cost effective package
  • Extend QFN I/O count up to 400


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