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LQFP/TQFP

Low profile and thin Quad Flat Packages (QFP) are classified by the overall thickness (t) according to JEDEC definition:

  • L type: 1.2< t <=1.7 mm
  • T type: 1< t <=1.2 mm
Low profile and thin QFPs are becoming popular, as they are ideal for the applications in lightweight and portable electronic products. ASE offers the lead count of LQFP/TQFP ranging from 32 to 256 and 44 to 176 respectively, covering almost all the applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs.

Exposed Pad L(T)QFP
The exposed pad can be soldered to the PCB so that the heat can be driven off directly (the JA is only half as much as the standard L(T)QFP). Besides, this pad is also electrically grounded, and thus results in far smaller ground inductance. Exposed pad L(T)QFP is a cost-effective solution suitable for enhancing thermal and electrical performance.


Application
Features

Telecommunication Products
• Cellular Phones
• Wireless LAN

Portable Products
• Personal Computer
• Personal Digital Assistants
• Digital Camera

Low to Medium Lead Count Packages
• Information Appliances

LQFP/TQFP
LQFPs are ideal package for lightweight and portable electronic products requiring broad performance characteristics. The low electrical parasitic out of the small outline and shorter leads makes LQFP suitable for RFICs. Other LQFP applications include lap-top PCs, memory, video ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets, telecom, office equipment, disc drives and communication boards.

EP-TQFP
Exposed Pad TQFP provides better thermal performance which gives IC designers the needed margin for high performance products. Common application of Exposed Pad TQFP packages are telecommunication, wireless, pagers, disk drives and RF modules.

LQFP/EP-LQFP Packing Offering

  • 7x7mm to 28x28mm body size available
  • Wide selection of pad size to meet die requirements
  • Customize leadframe design capability
  • 32 ~ 256 leads counts available
  • Fine pitch wire bond capability
  • Lead free process ready and available
  • High conductivity copper leadframes
  • Low stress die attach materials
  • Power enhancement version
  • JEDEC standard compliant

TQFP/EP-TQFP Packing Offering

  • 10x10mm to 20x20mm body size available
  • Wide selection of pad size to meet die requirements
  • Customize leadframe design capability
  • 44 ~ 176 leads counts available
  • Fine pitch wire bond capability
  • Lead free process ready and available
  • High conductivity Copper leadframes
  • Low stress die attach materials
  • Power enhancement version
  • JEDEC standard compliant



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