loading
English 中文

PLCC

Plastic Leaded Chip Carrier (PLCC) is widely used in micro-controllers and consumer electronics. Each lead of the PLCC is formed into a "J"-shape and folded under the package body. ASE provides PLCC packaging services in compliance with JEDEC standard. Lead count ranges from 20 to 84 with 1.27mm (50mil) lead pitch.


Application
Features

ASE's PLCC product was designed in compliance with JEDEC standard for 'J' shape leaded SMT packages. Its robust leads and smaller foot space makes it applicable for surface mount and replaceable plug-in assembly via sockets.

Design applications include,

  • Memory, Processors and Controllers
  • ASIC, DSP, PC Chipset Device for Consumer Products, Automotive and Aerospace

  • 453~1153mils body sizes
  • 28~84 available lead counts
  • JEDEC standard compliant
  • Wide selection of pad size to die size
  • High conductivity lead frame
  • Wide selection of pad size to meet die size per customized lead frame design capability
  • Pb-free process ready and available


為優化您的線上體驗,本網站使用Cookie。若您選擇繼續瀏覽本網站,視為您同意使用Cookie及接受本網站Cookie聲明條款。欲知悉更多Cookie的資訊,例如如何使用及停用Cookie,請參閱本網站Cookie聲明關於「如何變更Cookie設定或停用Cookie」的說明。