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QFN

Based on copper lead frame, Quad Flat No-lead (QFN) or microchip carrier uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB. QFN packages are suitable for applications over 12GHz working frequency. Providing both thermal and electrical enhancement, QFN is a cost-effective packaging solution due to its economical materials and simpler packaging process.


Application
Features

Telecommunication Products
• Cellular Phones
• Wireless LAN

Portable Products
• Personal Digital Assistants
• Digital Cameras

Low to Medium Lead Count Packages
• Information Appliances

  • Small footprint
  • Low profile (< 0.9 0.2 L/F + 0.65 Mold)
  • Light weight
  • Cost effective
  • Better electrical performance
  • Better power dissipation


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