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SiP & Module Solution

System-in-Package (SiP) meets growing demands for semiconductor miniaturization and multiple functions. SiP performs full functional system or sub-system functions at the package level. SiP has evolved into 2D & 3D integrated modules of several chip packages lined up side by side or stacked, or adding passives or other required components into the package to build a full sub-system function.

SiP main applications are 4C products including Computer, Communication, Consumer and Car electrics. Industry and market trend shows great convergence of 4C's in hand held products such as mobile phones, tablets, wearables and so on.

SiP main strategy are Small form factor, Innovated function, Flexible design, System integrated, High electrical performance, Low cost and Time to market.


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