打線式球格陣列封裝

打線式球格陣列封裝

Ball-grid arrays (BGA) are IC packages, which place output pins in the form of a solder ball matrix. The traces of the BGA are generally fabricated on laminated substrates (BT-based) or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has the advantage of lower ground or power inductance thereby assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA in order to reduce thermal resistance. The higher functional capabilities of the BGA package technology benefit high power and high speed ICs that require enhanced electrical and thermal performance. Compared with traditional SMT packages, the advantages of BGA are as follows:

• Higher interconnect density
• Lower assembly cost
• Self-alignment during reflow
• Lower profile
• Ease of thermal and electrical management
• Ease of routing

ASE Wire Bond BGA Packaging Offerings

 

Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has an overall thickness of over 1.7mm.

Applications

ASE PBGA's design and features improve the performance of

• Graphics
• PLDs
• DSPs
• PC Chipsets
• Communications
• Networking
• Microprocessors/Controllers
• ASIC, Gate Arrays
• Memory Packages

Features

BGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.

• 15x15mm to 45x45mm package
• 119 balls to 1520 ball count
• High interconnect density
• Low assembly cost
• Self-alignment during reflow
• Low profile
• Ease of thermal and electrical management
• Ease of routing
• Good power dissipation
• JEDEC MS-034 standard outlines
• Lead free process available
• Full In-house design capability

 

 

Heat Slug BGA (HSBGA) is an upgraded type of PBGA. Within the molding area, a piece of copper heat slug is implanted. The heat slug is intended to lower the thermal resistance (θJA) of PBGA without change of material. The θJA of HSBGA is generally 20% lower than PBGA and achieves 5 to 6W of thermal dissipation under natural convection. This technology can be applied to any kind of die-up substrates (e.g. 2- or 4-layer BT, and metal core). HSBGA is an excellent solution for cost-effective high power package, high-speed ICs like graphics chips, communication and networking ICs.

Applications

HSBGA is excellent for products that require improved thermal performance such as high power packages for high speed ICs in personal computers, networking and graphic ICs, data communication, consumer ICs and in telecommunication applications.

Features

HSBGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.

• 15x15mm to 45x45mm package available
• 120 balls to 1520 ball count available
• Cost effective
• Good electrical performance
• Good thermal performance
• Good power dissipation
• JEDEC MS-034 standard outlines
• Lead free process ready and available
• Full In-house design capability
• Full electrical and thermal characterization capability

 

 

Fine pitch Ball Grid Array (FBGA) are BGA package that follows JEDEC standard package outline dimension for DRAM products. To meet high speed DRAM requirement, FBGA can be designed the shorter trace length to provide better electrical performance than that of TSOP. Not only better electrical performance, FBGA's smaller package size allows higher memory density on memory module than that of TSOP package.

Applications

• Computer, Communication, and Consumer Devices
• Memory (SRAM, PSRAM, Flash, DRAM), Graphic, ASIC, Digital and Analog Products

Features

• 10x10.5 to 11x13mm packages are available
• Good electrical and thermal performance
• Low assembly and test cost solution
• Low profile
• JEDEC MO-207J standard outlines conforming
• RoHS and Halogen free conforming
• Good solder joint reliability
• Meet JEDEC drop test/TCT requirement