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Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has an overall thickness of over 1.7mm.


ASE PBGA's design and features improve the performance of

  • Graphics
  • PLDs
  • DSPs
  • PC Chipsets
  • Communications
  • Networking
  • Microprocessors/Controllers
  • ASIC, Gate Arrays
  • Memory Packages

BGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.

  • 15x15mm to 45x45mm package
  • 119 balls to 1520 ball count
  • High interconnect density
  • Low assembly cost
  • Self-alignment during reflow
  • Low profile
  • Ease of thermal and electrical management
  • Ease of routing
  • Good power dissipation
  • JEDEC MS-034 standard outlines
  • Lead free process available
  • Full In-house design capability