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智慧汽車

日月光的半導體封裝測試技術能協助新一代智慧汽車實現更高的安全性、舒適性及便利性。汽車市場正從耗油和污染空氣的燃油汽車轉向更節能的電動汽車。我們與汽車客戶密切合作,以高度整合的封裝技術與高安全規格的標準IC製造,整合各種感測器技術,如影像感測、環境感測、控制器等等,協助實現智慧汽車智能學習、分析和交流信息、節能並執行各種功能的需求。

日月光提供從封裝到模組完整的一站式製造服務,並提供具有成本效益的一元化解決方案,以加快產品上市時間。我們與全球一級汽車供應商建立長期的合作夥伴關係,且擁有車用TS16949、ISO26262、ISO/SAE 21434等相關認證。我們的產品和服務將為您的汽車應用提供高可靠性、高整合及高效率的完整封裝解決方案。

  • Airbag Control
  • Airbag – Facial Recognition
  • Side Airbag Sensor
  • Anti-lock
  • Electronic Stability Control
  • TPMS
  • LiDAR
  • Radar
  • Finger Print Sensor
  • Crash Sensor
  • Active Suspension
  • Ultrasonic Sensor
  • Engine Oil Pressure
  • Seat Occupant Sensor
  • Speed from Tire Rotation
  • Night Vision
  • Camera – Driver Monitoring, Collision Detection, Sign Reading

  • Leadframe

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • ADAS Control Module
  • LiDAR
  • Radar
  • Electronic Stability Control
  • Ultrasonic
  • Active Suspension
  • Night Vision
  • AI Co-pilot
  • AI Cockpit
  • Camera – Driver Monitoring, Collision Detection, Sign Reading

  • Leadframe

  • Wire Bond

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Climate Control
  • Ultrasonic
  • LiDAR
  • Radar
  • VOC, Alcohol Sensor
  • Engine Oil Pressure
  • Electronic Stability Control
  • Side Airbag
  • Seat Occupant Sensor
  • Humidity & Temperature Sensor
  • Camera – Driver Monitoring, Collision Detection, Sign Reading

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Fixed Navigation Systems
  • Audio Head Units
  • Infotainment Head Units
  • Rear Seat Entertainment
  • Seat Occupant Sensor
  • VOC, Alcohol Sensor
  • Display Control for Map – Proximity & Gesture

  • Leadframe

  • Wire Bond

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced

  • Flip Chip
  • Tire Pressure Monitoring
  • Electronic Stability ControlEngine Oil Pressure
  • Steering
  • Anti-lock Braking
  • Active Suspension
  • Speed from Tire Rotation
  • Brake/Accelerator Pedals

  • Leadframe

  • Wire Bond

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Electric Drive Controller
  • Electronic Stability Control
  • Air Intake
  • Battery Management
  • Active Suspension
  • Inverter
  • EV Charging Station

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU

  • IGBT+Coupler
  • Head-up Display
  • Display Dimming
  • Finger Print Sensor
  • Instrument Cluster
  • Display Control for Map – Proximity & Gesture
  • Camera – Driver Monitoring, Collision Detection, Sign Reading
  • Finger Print Sensor
  • Voice Control
  • Noise Cancellation
  • Night Vision

  • Wire Bond

  • Wafer Level

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced
  • Engine Control Module
  • Transmission Control Module
  • Diesel Engine Exhaust gas recirculation (EGR)
  • Engine Oil Pressure
  • Air Intake
  • Electronic Stability Control

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Portable Navigation Devices
  • Video Recorders
  • Audio Head Units
  • Rain Sensor
  • Infotainment Head Unit
  • Head-up Display
  • VOC, Alcohol Sensor
  • Airbag – Facial Recognition
  • Camera – Driver Monitoring, Collision Detection, Sign Reading

  • Leadframe

  • Wire Bond

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced

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