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智慧工廠 – 封裝解決方案

日月光的系統級封裝(SiP)技術,實現智慧工廠從“製造”到“智造”數字化的驅動技術。AIoT智慧工廠解決方案中以大數據分析、機台、環安衛與能源管理、倉儲管理為應用環境範例, 以互連技術串聯, 加強即時遠端監控和工廠管理,有效提高生產力。

  • Server/ HPC
  • 解決方案
  • 2.5D
  • Fan Out
  • Flip Chip

  • Motion sensing/ Particle Sensing/ Oven Temperature sensing/ Disruption prevention, predictive maintenance, utilization optimization
  • 解決方案
  • Connectivity with Processors
  • SiP, AoP/AiP, aEASI/SESUB, BLE Mesh, NB-IoT, 5G, Optical/Fiber
  • Sensors
  • Motion, Particle, Temperature, Humidity, Pressure, UV/IR

  • Dangerous zone monitoring/ Transformer temperature monitoring/ Operating zone humidity/ Temperature monitoring/ Thermal detection
  • 解決方案
  • Connectivity with Processors
  • SiP, AoP/AiP, aEASI/SESUB, BLE Mesh, WiFi, LoRaWAN, NB-IoT, 5G
  • Sensors
  • Motion, Particle, Temperature, Humidity, Pressure, UV/IR

  • Nitrogen cabinet humidity & temperature data capture/ Raw material management
  • 解決方案
  • Connectivity with Processors
  • SiP, AoP/AiP, aEASI/SESUB, BLE Mesh, WiFi, LoRaWAN
  • Sensors
  • Temperature, Humidity, RFID, Airflow

 

 

 

 

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