Antenna in Package (AiP) or antenna on Package (AoP) has emerged as the mainstream antenna packaging technology for various millimeter-wave (mmWave) applications. ASE develops and offers cutting-edge AiP solutions through our leadership in SiP technology. We provide a complete suite of AiP manufacturing capabilities from system design, software development, module testing to electro-thermal simulation that enable our customers to develop smaller, higher performance, lower power consumption and more cost effective mmWave products.
Developments in 5G is advancing rapidly, and this 5th generation mobile network will transform the way we interact with our world by bringing a higher level of user experience over existing wireless technologies in terms of latency, reliability, efficiency, user and system capacity.
Today, each mobile device contains numerous communication modules that exchange wireless data with the external environment. In most 4G devices as well as sub-6GHz applications, antennas are manufactured in discrete form, e.g., as a printed shape on the PCB or as an individual component to be assembled near the RF front end chip (transceiver) with an associated matching circuit. Thanks to significantly smaller antennas at mmWave frequencies, the antenna in the mmWave band can be directly integrated in the package. The industry is already developing new IC packages for 5G mmWave by combining the transceiver and the antenna in the same package to position the transceiver closer to the antenna to boost the signal.