With the anticipated market needs of integrating more chips and functions, higher performance, lower power consumption and better heat dissipation onto a smaller form factor, demand for embedded die substrates, such as a-EASI® or SESUB, is expected to increase globally.
ASE offers customers a full turnkey solution of embedded die substrates through our advanced packaging and test expertise as well as substrate design and manufacturing capability.
Conventionally, active semiconductor chips (or dies) are mounted on top of a substrate for structural support and electrical interconnect. But in the embedded die substrate, a semiconductor die is embedded within standard PCB material (i.e., a plurality of organic laminated layers) and/or a lead frame during formation of the substrate. The semiconductor die is then electrically connected to other components (MEMS or passives) on/in the substrate through copper-plated vias and conductive traces of the substrate.
Miniaturization & Design Flexibility
Improved Thermal & Electrical Thermal Performance
Improved Reliability and Mechanical Stability
ASE's Embedded (Chip) Technology is considered an alternative solution to achieve higher level integration with multi-functionalities and form factor shrinkage advantages. ASE a-EASI is suitable for power electronics applications to reduce power loss and high thermal dissipation which also had robust mechanism. Embedded Technology provides SMT integration and flexible routing solution to reduce PCB size. The short connection path though Cu via structure. a-EASI® applied metal lead frame to die placement which has high thermal dissipation and EMI benefit.
via direct on chip pad
via direct on chip pad
SESUB (Semiconductor Embedded in SUBstrate) is a technology that embeds the IC in the laminated substrate. This substrate with the thinned IC embedded can be mounted with various electronic components to form a highly integrated, multiple function module/package. SESUB enables the micro-modularization of functional circuitry such as high-performance PMUs for smartphones as well as Bluetooth modules. SESUB has already been a proven technology by many customers and IC vendors.
A broad application coverage including:
The figure below illustrates the cross-section view of a multi die embedded module utilizing SESUB technology. The SESUB is a 1-2-1 4-layer structure which provides properties for size reduction, thermal dissipation, mechanical robustness, performance improvement. SESUB not only serves as module, but also as package with thin thickness.
The properties include
