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Flip Chip BGA

Flip Chip Organic BGA
Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA package especially in high frequency applications.

Flip Chip Ceramic BGA
Alumina ceramic substrate offers better moisture resistance, electrical insulating property and higher thermal conductivity than organic substrate. FCBGA is used primarily for high-reliability commercial applications (e.g. CPU).



Application
Features
Consumer
  • Graphics/Chipsets for PC
  • Server
  • Game Console and High-end Application
  • Microprocessor for PC & Server
  • Memory
Telecommunication
  • Network Products (LAN)
  • Switching
  • Transmission
  • Cellular Base Stations
  • Substrate: 4 layer laminate, 4~12 layer & 800/400um. Build-up substrates, and ceramic substrates are available for different application
  • Passive Component: Passive component attaching is available. It can be placed on the top or bottom side of the package
  • Ceramic BGA: High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages

Reliability

Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A113 Level 3, 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 500/1000 cycles
THT JEDEC 22-A101 85°C/85% RH, 500/1000 hrs
HAST JEDEC 22-A118 130°C/85% RH, 33.5psi, 50/100 hrs
HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
PCT JEDEC 22-A102 121°C/100% RH, 15psig, 96/168 hrs



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