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Flip Chip CSP

FCCSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os around 200 or less. FCCSP provides better protection for chip and better solder joint reliability compared with direct chip attach (DCA) or chip on board (COB). FCCSP is more superior to known good die (KGD) in low-cost test and burn-in, and performs comparable electrical function with KGD. FCCSP features thin and small profile, and lightweight packages.

  • Camcorders
  • Digital Camera
  • DVD
  • Voltage Regulators
  • High-speed Memory
  • Card
  • PC Peripherals
  • Pagers
  • Cellular Handsets
  • GPS
  • Thinner Profile: “Wafer Thinning” capability (down to 6~8 mils) to support packages thinner than 1.0 mm
  • Substrate: 2-layer BT laminate substrate is used to reduce overall package cost
  • Improved Performance: Thin core (100um) substrate & via-on-pad design can be adopted to achieve better electrical performance
  • Robust Structure: Over molded process can enhance throughput, component and board level reliability
  • NSMD with OSP C4 pad: Low cost solutions for electric interconnect between solder bump and substrate


Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A113 Level 3, 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 500/1000 cycles
THT JEDEC 22-A101 85°C/85% RH, 500/1000 hrs
HAST JEDEC 22-A118 130°C/85% RH, 33.5psi, 50/100 hrs
HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
PCT JEDEC 22-A102 121°C/100% RH, 15psig, 96/168 hrs

Board Level
  • Weibull distribution of FCCSP 48L with different surface finish
  • 0.30mm dia. SN63/Pb37 solder ball
  • Test Condition: -40 ~ 125°C air-to-air
  • Ball composition of LF35 or SAC105 were applied on green/RoHS package