HP Flip Chip BGA
HFC BGA (High Performance FCBGA), a thermally enhanced FCBGA, is the composite package of FCBGA with heat spreader made of Cu, Al, or AlSiC. The heat spreader is used to extend the heat conduction area by connecting itself to the rear side of the silicon chip.
This method desensitizes the performance deviation out of the chip size, lowers the thermal resistance of junction-to-case (θjc) and enables the external heat sink or fan to work more effectively. HFCBGA can produce 6~8 watts of power dissipation under natural convection.