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HP Flip Chip BGA

HFC BGA (High Performance FCBGA), a thermally enhanced FCBGA, is the composite package of FCBGA with heat spreader made of Cu, Al, or AlSiC. The heat spreader is used to extend the heat conduction area by connecting itself to the rear side of the silicon chip.

This method desensitizes the performance deviation out of the chip size, lowers the thermal resistance of junction-to-case (θjc) and enables the external heat sink or fan to work more effectively. HFCBGA can produce 6~8 watts of power dissipation under natural convection.



Application
Features
Computer
  • Graphics/Chipsets for PC
  • Server
  • High-end Application
  • Microprocessor for PC & Server
Telecommunication
  • Network Products (LAN)
  • Switching
  • Transmission
  • Cellular Base Stations
  • Substrate: 4 layer laminate, 4~12 layer build-up, ceramic, and PTFE substrates are available
  • Thermal Lids: Heat spreaders made of Cu with Ni plating, Aluminum, Ceramic, AlSiC
  • Passive Component: Passive component attaching. It can be placed on the top or bottom side of the package
  • Ceramic BGA: High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages

Reliability

Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A113 Level 4, 30°C/60% RH, 96 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 500, 1000 cycles
THT JEDEC 22-A101 85°C/85% RH, 500/1000hrs
HAST JEDEC 22-A118 130°C/85% RH, 33.5 psi 50/100hrs
HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
PCT JEDEC 22-A102 121°C/100%RH , 15 psig, 96/168hrs


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