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ASE Turnkey Services

Increased sophistication, complexity and miniaturization of systems are speeding up developments in advanced packaging technology. It can be more cost-effective for companies to rely on independent specialist assembly and test houses to substantially reduce their backend production costs.

Effective utilization of independent semiconductor manufacturing services enables integrated device manufacturers (IDMs) and fabless companies to maximize revenue while minimizing costs. These companies are consequently better able to focus on their core competencies such as IC design and end-product marketing.

ASE Group offers stand-alone backend manufacturing services in areas ranging from engineering test and package design to substrate manufacturing, assembly, final test and DMS to complement customers' own manufacturing processes.

Given the increasing significance of substrates in the process of IC packaging, ASE is aggressively expanding into substrate manufacturing. Customers can benefit from timely access to material source.

ASE Turnkey Services ASE Turnkey Services


ASE provides the most complete, fully integrated semiconductor backend service in the industry, including - Assembly, Testing, and Material services. This enables our customers to conduct total cost management and enjoy greater flexibility in both forward and backward integration.

The extensive array of products and services we provide allow our customers to choose the IC package best suited to both their needs and the rigorous market requirements.

Assembly Offerings

ASE, among the leading IC packaging companies in the world, provides versatile, reliable and value-added services.

Test Service Offerings

ASE provides a complete range of semiconductor testing services that are among the most advanced in the semiconductor industry.

Material Offerings

ASE has focused on the research and development of substrate technology for the next generation IC package solutions.


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