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Welcome to VIPack™

There are still many unknowns as we continue through challenging global times. However, it is inspiring to see such game-changing innovation within the semiconductor industry, ultimately enabling applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, from 5G to beyond. Collectively, we are helping to improve lifestyles and efficiencies by creating a smarter and more sustainable world for generations to come.ASE is blazing new trails in device miniaturization and integration, and ongoing innovation means we are delivering advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets, such as automotive, 5G, AI, IoT, high performance computing, and more.In recent times, we have presented many solutions for SiP. Today we present ViP, or VIPack™, an advanced packaging platform designed to enable vertically integrated package solutions. VIPack™ represents ASE’s next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package. To summarize, the VIPack™ platform enables heterogeneous integration through multi stack RDL layered package structures.ASE’s VIPack™ addresses the following device challenges: insertion loss, integration challenges, clock/speed, height, power delivery, and dense IO, all very critical area, and it is specifically geared towards mobile, high-performance computing, networking, and RF.The VIPack™ platform comprises six core packaging technology pillars supported by a comprehensive and integrated design ecosystem. These technology pillars include ASE’s high density RDL based FOPoP, FOCoS, FOCoS-Bridge, and FOSiP as well as TSV based 2.5D/3D IC and Co-Packaged Optics processing capabilities. It provides vast capabilities necessary to enable the next generation highly integrated silicon packaging solutions required to optimize clock speed, bandwidth, power delivery and the ability to optimize co-design time, product development and time to market. Such includes Double Sided RDL/Fan-Out, RDL Integrated Passives, Ultra Dense Routing, Advanced Materials, and DTC Integration.VIPack™ touches most market segments and has many sub-package platforms where high performance is needed or alternative solutions to ABF/Substrate based routing. It will extend most advanced package technology roadmaps and there are significant cost and performance advantages when considering VIPack™.Ultimately, today’s advanced silicon nodes are pushing the limits of power delivery where noise and performance are critical while managing overall power. VIPack™ enables a suite of packaging solutions, addressing multiple market segments, that are targeted to provide solutions to these challenges and enable an extension to advanced packaging roadmaps.We welcome you to discuss VIPack™ with us!For more about VIPack™, please visit ase.aseglobal.com/en/vipack

Enabling next-generation System Integration with scalable SiP solutions for Healthcare Applications

Semiconductor miniaturization and chip integration trends are driving greater industry focus on system-in-package (SiP) developments. SiP is a cost effective package integration technology that features higher performance and reduces time to market. These advantages allow chip companies to design electronic products that integrate more functions and develop new technology applications. Dr CP Hung, vice president, ASE Corporate R&D offers an insight on the application of SiP technology in healthcare electronics.Continuous Glucose MonitorA continuous glucose monitor (CGM) is a small wearable device that tracks blood sugar levels throughout the day and help detects trends and patterns. The data allows doctors and patients to better manage diabetic conditions. A CGM consists of a sensor, data transmitter and receiver, and the results are tracked via a monitor or a smartphone app.ASE’s SiP technology supports the integration of different microcontrollers (MCUs), application-specific integrated circuits (ASICs), antennas and sensors that control all the functions in a CGM, onto a single package structure. The packaging process offers miniaturization without compromising the performance of the device.In Vitro Diagnostics In vitro diagnostics (IVD) are tests performed on samples, such as mucus or blood, taken from the human body to help detect diseases or other conditions. The information obtained from analysis of such samples are used by health practitioners to monitor a patient’s overall health, and to treat or prevent diseases. A variety of IVD devices and systems are used by healthcare professionals in clinics, labs and hospitals, as well as by consumers at home.Complex IVD module designs are made possible with SiP technology processes that allow the integration of the bio-sensor chips and the microfluid receptacle through the use of customized molding techniques.Sensor ApplicationsWafer-level SiP technology is another packaging technique that applies through-silicon via (TSV) chip-scale package (CSP) processes to reduce the XY area size by 30% compared with traditional quad flat no-lead (QFN) packaging. At the same time, the electrical performance of the package structure is enhanced through lowering the resistance level by almost 80%.Sensor Hub A sensor hub is a microcontroller unit that integrates and processes data from various sensors. Through-silicon via (TSV) and chip-to-wafer (C2W) bonding are techniques used to design chips inside sensor hubs. Other methodology of chip design include placing ASIC and sensor components side-by-side, or placing a TSV die on top of another standard die.Wafer-level SiP technology can be applied in many types of sensor packages including 3D inertial, gas, temperature and humidity sensors. The data in the diagram shows that WL SiP package sizes can be reduced by between 25% to 77% compared with traditional packaging processes.ASE provides a complete suite of packaging and test services – from package design, functional simulation to testing, verification, volume production and final testing. ASE continues to provide industry-leading system-in-package integration solutions to help customers speed up product development.

Unlocking More in Wearable Devices

The rapid development of smart wearable devices is driving improvements in sensor and packaging technology that offers unprecedented business opportunities for the semiconductor industry. System-in-Package (SiP), a packaging technique that enables highly integrated miniaturized systems through the integration of different sensors and chips with multiple functions (MCU, memory and more) within a small form factor, is fast becoming the preferred packaging solution for future wearable devices.SiP technology is designed to enable dense circuitry, which in turn allows miniaturization, lowers power consumption, improves radio frequency and maximizes functional capacity. Additional IC testing and testing of aged units further ensure chip performance and consistent quality. From smart watches, smart glasses to Bluetooth headsets, SiP integration technology is enabling chip designers to customize solutions easily. For example, more than 30 components can be integrated onto a single chip with a size of 4mmx8mm or 4.55mmx9mm, vastly reducing the product size and its overall weight by 1 gm or more.Watch MoreSiP Solutions for HearablesIn the designing of hearable devices, miniaturization is achieved through SiP packaging because it reduces the motherboard area and mitigates radio frequency and audio interference. Features like acoustic design and active noise control can be easily adjusted thereby, freeing up more space to optimize the acoustic cavity design to produce better sound quality and increase battery life. The addition of a built-in antenna using an AiP (Antenna-in Package) solution can further optimize the isolation between audio and radio frequency.ASE’s SiP solution provides several advantages to customers:Reduces inventory and material inspections, simplifying assembly and testing processes.Reduces assembly manpower and work processes.Provides customized solutions that meets product design and acoustic specifications.Reduces time-to-market and provides a cost competitive solution.The ASE SiP ToolboxASE offers customers a complete SiP solution covering:Module design and developmentSiP development board and antenna designPCBA software and hardware integration, development and debuggingVolume assembly and testing solutions

Premiering ASE Technology and Solutions at 2021 WSCE China

At this week's World Semiconductor Conference held in Nanjing, China, ASE, together with SPIL and USI, showcased the company's complete solution platform that encompasses its leadership in System-in-Package (SiP) and Advanced Packaging. ASE is a primary architect in Heterogeneous Integration which is helping to drive developments in HPC, IoT and automotive electronics.Unleashing the synergy of ASE, SPIL and USI to drive chip performance and solve chip design challengesChip First and Chip Last Fan-Out Packaging solution platform which allows the designing of high performance computing chips with high density2.5D/3D IC packaging solutions supporting high bandwidth and low latencyDesign and manufacturing experience in chiplet packaging technology at SPIL – the portfolio includes FO-MCM+EHS-FCBGA(Fan-Out Multi-Chip-Module + Exposed Heat Sink-Flip Chip BGA), HBW-POP(High Bandwidth Package-on-Package), FO-POP(Fan-Out Package-on-Package), ETS-SiP(Embedded Trace Substrate-System in Package), FO-SD(Fan Out-Single Die)USI’s proven miniaturization capabilities that support the wireless and mobile communication markets including LTE Cat.1 communication module, TWS Bluetooth audio module, wireless communication module, dual-core wireless microcontroller (MCU) equipped with Bluetooth®5, OpenThread and ZigBee®3.0. USI’s solutions are widely applied in devices with small footprints such as fitness watches and wearable products, TWS headsets, mobile devices, routers, industrial IoT, healthcare devices and tracking devicesEnabling a Smarter World We are accelerating a smarter world through our advanced packaging and module solutions.Complete Solutions for Smart Factories, Smart Cities and IoT-SiP (ASE, SPIL) + System-on-Modules (USI)Safety and Reliability in Smart Automotive. Wire bond, flip chip, WLCSP, SiP and discrete packaging portfolio (ASE, SPIL) + automotive power control modules (USI)ISE Labs China is our first engineering center in China that has received VDA6.3 and AECQ certification and mass production qualifications for automotive electronic chips.Smart Wearables. ASE’s TWS SiP modules enable more functions to be integrated onto a limited space. DockSiP and MicroSiP packaging solutions support miniaturization and ease of integration. Other solutions include integrated MEMS & Sensors, low-power antenna packaging and double-sided thin wireless communications.Playing a Leading Role through Innovation, Investment and CollaborationInvited to speak at the Innovation Summit, Dr. KK Kuo (VP, R&D ASE CHINA) provided his insights on the industry landscape and remarked, ‘The 5G+AI digital era and the evolution of Moore's Law has accelerated the demand for chip miniaturization, high performance and low power consuming chips that contribute to continuous breakthroughs in advanced packaging technology. Heterogeneous integration applications are on track to demonstrate explosive growth in the future, driven by rapid growth in high-performance computing (HPC), 5G, application processor engines (APC), automotive radars, radio frequency, audio, power management integrated circuits (PMIC) and many other applications. High-density packaging will increase in importance and advanced packaging and SiP will help drive the development for the next generation of semiconductor technologies. ASE Group will continue to play a leading role through innovation, prudent investments and industry collaboration.’

Heterogeneous Integration Fuels the Future

Moore's Law has driven the semiconductor industry for decades, but in recent years, there has been deceleration in terms of performance and economic benefit. The exponential cost of silicon scaling has created an inflection point for the industry, and that is driving the development of More-Than-Moore technologies to augment device functionality and strengthen system performance. A Brief History of Semiconductor RoadmapsThe semiconductor industry comprises highly specialized yet closely interdependent companies that must stay on top of technology and market application trends to keep developments on track. As the industry grew, it became imperative by the 1990s that global semiconductor companies must work together to ensure progress was heading in the same direction. In 1991, semiconductor companies in the United States, under the auspices of the Semiconductor Industry Association (SIA), first established the National Technology Roadmap for Semiconductors or NTRS. By 1998, roadmapping efforts had expanded when companies from Japan, Europe, Korea, and Taiwan joined the NTRS effort, and together with SIA, they formed the International Technology Roadmap for Semiconductors (ITRS). SIA brought ITRS to a close in 2015, and that is when the Heterogeneous Integration Roadmap, or HIR, was initiated. Heterogeneous Integration Will Take Us ForwardHeterogeneous Integration refers to the integration of separately manufactured components into a higher-level assembly system-in-package (SiP) that in the aggregate provides enhanced functionality and improved operational characteristics. It is now the key technology direction going forward, driving the pace of advancement for greater intelligence and connectivity, higher bandwidth and performance, and lower latency and power per function, all at a more manageable cost. The Heterogeneous Integration Roadmap (HIR) is a roadmap to the future of electronics that identifies technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration among industry, academia, and government to accelerate progress. HIR is designed to provide long term continuity and a broad technology base. It is organized with sponsorship by three IEEE Technical Societies (Electronics Packaging Society, Electron Devices Society, and Photonics Society) together with SEMI and ASME Electronics and Photonics Packaging Division (EPPD). Technology takes a long time to develop and mature, and increasingly involves the collective knowledge from overlapping fields. It is therefore essential to set goals for the long-run and cover as many subjects and fields as possible, related to heterogeneous integration. As the industry enters the digital transformation and exascale computing era, massive compute with frequent access to data is required for high performance computing (HPC) applications. The increasing amount of data from all sectors is raising the issue of operational and storing cost of the data. The advent of artificial intelligence (AI) and machine learning (ML) requires large amounts of data to be processed and is driving an entirely new computing paradigm from edge computing to cloud to data centers. Traditional IC design trends are to pack more transistors on a monolithic die or system-on-chip (SoC) at each process node, resulting in difficult chip scaling for the integration of analog, logic, and memory circuits. The heterogeneous integration approach is die-partitioning or chiplets, which offers a compelling value proposition for yield improvement, IP reuse, performance, and cost optimization, as well as time-to-market reduction. Chiplet integration has the potential to allow the integration of disparate technologies from multiple suppliers to provide more flexible mix-and-match systems to accelerate performance and improve power efficiency without requiring the deployment of these technologies across an entire SoC simultaneously. Chiplet solutions start with internal designs within a system integrator. However, as IP interface standards are developed, the commercialization of chiplets in the market will proliferate. Heterogeneous Integration through chiplets will play a critical role for future HPC and AI/ML applications.ASE System-in-Package (SiP) Demonstrates Heterogeneous Integration. As a leading semiconductor packaging, test, and system service provider, ASE has heavily invested in both chip-level (SoC) package integration and system-level integration. The development of cutting-edge heterogeneous integration technologies addresses functional areas from silicon integration, power integration, optical integration to system integration that form the backbone of many electronic components, subsystems, and electronics products. ASE has developed and offers a wide portfolio of Si-level integration technology solutions, from low- to high-density chiplet integration including flip-chip multi-chip-module (FC-MCM), fanout chip-on-substrate (FOCoS), and 3D IC. The advanced FOCoS technology can provide short die-to-die connection and high interconnections (10,000s), redistribution layers (RDL) with 2µm line/space, and up to four layers for chip-first and chip-last packaging processes. It produces a lower-cost solution with improved electrical performance compared to a 2.5D Si interposer solution due to the elimination of Si through silicon via (TSV) processes and reduced insertion loss. ASE is evolving this advanced packaging platform to meet application demands for HPC and AI/ML applications. A Smarter, Healthier, More Efficient FutureLooking further into 2021 and beyond, key developments in packaging that create higher performance systems and utilize less power will be deployed. System performance will continue the pace of Moore’s Law era, albeit in a different way than with the previous total reliance on semiconductor chip lithography and SoC integration. There is tremendous optimism that innovations in the IC packaging industry will continue on a heterogeneous integration journey. Discovery, creativity, innovation, and very importantly, collaboration – will enable applications that make our world smarter, healthier, and infinitely more efficient. This article has been adapted from the blog article ‘The Future is Heterogeneous Integration’ by Dr Bill Chen. To read the full article, please click on https://www.3dincites.com/2021/01/the-future-is-heterogeneous-integration/

Trends and Development in Heterogeneous Integration: Advancing the Smart Digital Age with System-in-Package and Chiplet Technologies

Heterogeneous integration (HI) is fast becoming a key driver of semiconductor development due to its ability to scale the number of individual chips onto a miniaturized system-in-package that enhances functionality, achieves higher efficiency, and even reduces power consumption. At the recently concluded SEMICON CHINA 2021 Advanced Packaging Forum, Dr KK Kuo (VP, R&D at ASE Jiangsu) delivered an insightful presentation on the trends and developments in Heterogeneous Integration and Fan-out Wafer Level Packaging.At present, HI technologies are enabled by: system-in-package (SiP) packaging that allows miniaturization and a higher level of integration; 2D/3D IC packaging that delivers higher bandwidth and lower latency; and Fan In/Fan Out Wafer Level Packaging (WLP) that achieves higher performance and higher density. To provide IC designers a robust automated design solution that addresses heterogeneous integration parameters, ASE collaborated with Deca Technologies and Siemens Digital Industries Software to launch the APDK™ (Adaptive Patterning® Design Kit). The APDK methodology provides IC designers a library of templates, extensive automation that guides the designer from initial layout to Adaptive Patterning simulation, to final design sign-off using Siemens’ Calibre software. ASE’s experience in volume production of highly integrated SiP including its M-series Fan-out WLP technology, demonstrates the company’s leadership in advancing device and system performance.Another trend in HI is the development of chiplets, a relatively inexpensive method that can quickly assemble independent IC chiplets (smaller and usually less expensive chips) through die-to-die interconnect, that when combined, accelerates the performance and power efficiency of the integrated package. An example of a chiplet architecture is the integration of CPU cores, memory ICs and 3D stacking technology to vastly improve bandwidth and interconnect quality. Chiplet designs are gaining popularity as the approach shortens the design leadtime and lowers the cost threshold – IC designers do not need to fabricate new chips using expensive nodes and fab processes. This methodology is now widely applied in designing high-end processors, FPGA and networking ICs.SPIL (a member of the ASE Technology Holding Co), has developed several fan-out packaging technologies to support chiplets including; Flip Chip Multi-Chip Module (FCMCM), 2.1D/2.5D/3D, Fan Out Multi-Chip Module (FOMCM), Fan-Out Embedded Bridge (FOEB) and Embedded Multi-die Interconnect Bridge (EMIB). The high acceptance rate of these process technologies are contributing to lower manufacturing costs and improving speed to market.Innovation in the packaging world is game changing, and the combined synergy from ASE, SPIL and USI is raising the company’s competitive edge and industry R&D standards. ASE is also building strong supply partnerships and expanding market opportunities to provide solutions that deliver high performance, speed and efficiency. We sincerely believe that our Heterogeneous Integration journey will contribute immensely to the next generation of smart digital applications.Source: SPIL, 2020 VLSI Circuit Symposium

2.5D vs Fan-out Chip on Substrate

The demand for high bandwidth and high-performance applications such as networking, AI computing and GPU IC chips are driving innovative developments in advanced IC packaging. Heterogeneous integration enables the integration of multiple chips using fine line/space interconnect packaging technology.Heterogeneous integration packaging solutions offered in the market today include, through silicon via (TSV) interposer technology: 2.5D IC packaging and re-distribution layer (RDL) fan-out process better known as fan-out chip on substrate package (FOCoS).FOCoS fabrication methods include chip first and chip last processes. We have utilized FEA simulations to examine the warpage, ELK layer crack risk, interconnection/RDL trace broken risk, and board level solder joint reliability of three package types: 2.5D IC, chip-first FOCoS and chip-last FOCoS. The validity of the simulation model is confirmed by comparing the numerical results for the warpage and thermal mechanical deformation of chip-last FOCoS with the experimental observations by advanced Metrology Analyzer (aMA) system. Further CFD simulations are then performed to investigate the heat dissipation performance of the three package types.We have investigated the warpage and in-plane thermal deformation of packages at various environment temperatures. Three-dimensional numerical models have been developed to compare the mechanical and thermal performance. The warpage and inplane thermal deformation of the FEM model has been validated with the measurement result. Having validated the FEM model, this study applied the FEA investigations to package types' comparison and examine the influence of the chip-last FOCoS wafer level underfill material properties on the D2D area interconnection copper trace reliability.The results from the numerical simulation are as follows:The warpage of the two FOCoS package types are lower than 2.5D IC due to smaller CTE mismatch between combo die and stack-up substrate. Besides, the chip-last FOCoS has the lowest warpage quantity with the contribution of wafer level underfill.The ELK stresses of FOCoS for both chip-first and chip-last are lower than 2.5D package, because RDL/PI layers are the effective buffering to reduce ELK layer stress.The solder ball with maximum CSED occurs on the outermost solder joint located on the package edge of the solder joint top side, i.e. substrate side, surface. All these three packages have insignificant difference on CSED. It means that the board level TCT performance is similar because the equivalent CTE of all the package types are similar.The interconnection copper trace stress of 2.5D package has lower stress than others due to smaller localized CTE mismatch to reduce copper trace stress.The wafer level underfill type D with higher Tg and lower CTE has lowest stress, which could enhance copper trace reliability performance.2.5D IC, chip-first FOCoS and chip-last FOCoS have similar thermal performance and all of them are good enough for high power applications.More information can be found in the ECTC article entitled "A comparative study of 2.5D and fan-out chip on substrate: Chip first and chip last".

Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-out Chip Last Packages

In recent years, Fan-Out (FO) packages have become widely used in handheld, mobile consumer and internet of things (IoT) devices. FO packaging allows greater I/O density as well as the ability to pack multiple components in the same package compared to conventional wafer level chip scale package (WLCSP). Several types of FO packaging are offered in the market today, for example; embedded wafer level BGA (eWLB), M-Series™ as well as a flip chip based structure referred to as Fan-out Chip-Last Package (FOCLP).We have investigated the mechanical and thermal performance of these FO packages. Finite element analyses were carried out to examine mechanical performance metrics, including warpage, stress in the extreme low-k (ELK) interconnect and board level solder joint reliability. Thermal simulations were completed to compare the thermal dissipation differences among the FO package types. We also applied the optical profile measurement facility advanced metrology analyzer (aMA) to investigate the correlation between in plane strain and out-of plan warpage of fan-out packages at various environment temperatures. A three-dimensional computational model has been developed to compare mechanical and thermal performance of different fan-out package types.The aMA measurement results have shown that the warpage quantity of M-Series™ structure is lower than eWLB. Besides, the dimension change of eWLB is higher than M-Series™. The performance of the fan-out packages FE model has been verified by comparing the simulation results for the package in-plan dimension change with those obtained experimentally.In addition, the numerical simulation results show that:The maximum warpage of all types are less than 25um. FOCLP has higher warpage due to high CTE mismatch between thin coreless substrate and compound. Besides, the M-Series™ has lower warpage quantity because backside coating film help to balance CTE mismatch to reduce warpage.The ELK stress of FOCLP and M-Series™ are similar and lower than other package types. This is the result of the molding compound RDL above the copper pillars acting as a stress buffer.The solder ball with maximum Creep strain energy density (CSED) occurs on the outermost solder joint located on package edge at theUBM edge. eWLB and M-Series™ packages have similar CSED, while FOCLP has lowest CSEDvalue. This is due to less CTE mismatch between the PCB and the FOCLP package.The different types of fan-out packages have similar thermal performance and, overall, dissipate heat better than WLCSP.More information can be found in the ECTC article entitled "Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-out Chip Last Packages".

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