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Capabilities
Advanced Technologies
Overview
Heterogeneous Integration
2.5D & 3D IC Packaging
FOCoS
Silicon Photonics
System-in-Package
Double Side Moldings (DSM)
Fan-Out System in Package
3D System-in-Package
Antenna in Package
Embedded Die Substrate
MEMS & Sensors Packaging
IC Packaging
Overview
Leadframe Packaging
Wire Bond BGA
Flip Chip Packaging
Wafer Level Packaging
Fan-Out Packaging
Others
Test Services
Packaging Substrate
Substrate Design
Package Design
Lab Services
Applications
Smart Home
Smart Bike
Smart City
Smart Automotive
Smart Factory
Sustainability
Overview
Sustainability Governance
Environment and Green Innovation
Employee Care & Development
Supply Chain Development
Social Involvement
Press Center
Press Room
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Blog
About ASE
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English 中文
Capabilities
Advanced Technologies
Overview
Heterogeneous Integration
2.5D & 3D IC Packaging
FOCoS
Silicon Photonics
System-in-Package
Double Side Moldings (DSM)
Fan-Out System in Package
3D System-in-Package
Antenna in Package
Embedded Die Substrate
MEMS & Sensors Packaging
IC Packaging
Overview
Leadframe Packaging
Wire Bond BGA
Flip Chip Packaging
Wafer Level Packaging
Fan-Out Packaging
Others
Test Services
Packaging Substrate
Substrate Design
Package Design
Lab Services
Applications
Smart Home
Smart Bike
Smart City
Smart Automotive
Smart Factory
Sustainability
Overview
Sustainability Governance
Environment and Green Innovation
Employee Care & Development
Supply Chain Development
Social Involvement
Press Center
Press Room
Events
Blog
About ASE
Company Info
Corporate Governance
Intellectual Property
Financials
Careers at ASE
Global Manufacturing
Contact Us

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