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Capabilities
Advanced Technologies
Overview
Heterogeneous Integration
System-in-Package
2.5D & 3D
Fan-Out Packaging
Embedded Die Substrate
MEMS & Sensors Packaging
Antenna in Package
FOCoS
IC Packaging
Overview
Flip Chip Packaging
Wire Bond BGA
Leadframe Packaging
Wafer Level Packaging
Others
Packaging Substrate
Substrate Design
Package Design
Bumping Services
Test Services
Applications
Smart Home
Smart Bike
Smart City
Smart Automotive
Smart Factory
Sustainability
Overview
Sustainability Governance
Environment and Green Innovation
Employee Care & Development
Supply Chain Development
Social Involvement
Press Center
Press Room
Events
Blog
About ASE
Company Info
Corporate Governance
Intellectual Property
Financials
Careers at ASE
Global Manufacturing
Contact Us
English 中文
Capabilities
Advanced Technologies
Overview
Heterogeneous Integration
System-in-Package
2.5D & 3D
Fan-Out Packaging
Embedded Die Substrate
MEMS & Sensors Packaging
Antenna in Package
FOCoS
IC Packaging
Overview
Flip Chip Packaging
Wire Bond BGA
Leadframe Packaging
Wafer Level Packaging
Others
Packaging Substrate
Substrate Design
Package Design
Bumping Services
Test Services
Applications
Smart Home
Smart Bike
Smart City
Smart Automotive
Smart Factory
Sustainability
Overview
Sustainability Governance
Environment and Green Innovation
Employee Care & Development
Supply Chain Development
Social Involvement
Press Center
Press Room
Events
Blog
About ASE
Company Info
Corporate Governance
Intellectual Property
Financials
Careers at ASE
Global Manufacturing
Contact Us

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