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Capabilities
Advanced Technologies
System-in-Package
Heterogeneous Integration
2.5D & 3D
Fan Out Packaging
Embedded Die Substrate
MEMS & Sensors Packaging
Antenna in Package
FOCoS
IC Packaging
Flip Chip Packaging
Wire Bond BGA
Leadframe Packaging
Wafer Level Packaging
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Corporate Governance Comparison
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Employee Care
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Supplier Awards
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English 中文
Capabilities
Advanced Technologies
System-in-Package
Heterogeneous Integration
2.5D & 3D
Fan Out Packaging
Embedded Die Substrate
MEMS & Sensors Packaging
Antenna in Package
FOCoS
IC Packaging
Flip Chip Packaging
Wire Bond BGA
Leadframe Packaging
Wafer Level Packaging
Others
Packaging Substrate
Substrate Design
Package Design
Bumping Service
Tray Service
Test Service
Applications
Smart Living
Smart Bike
Smart City
Smart Automotive
Smart Factory
Investor Relations
Shareholder Services
Annual Reports
Dividends History
Shareholders' Meeting
Financials
Monthly Revenues
Quarterly Results
Financial Reports
Stock Exchange Filings
XBRL Files
Corporate Governance
Board of Directors
Corporate Governance Comparison
Conflict Minerals Compliance
Events & News
IR Events
IR News
FAQ
Sustainability
Governance
Corporate Sustainability Policy
Regulatory Compliance and Risk Management
Business Conduct and Ethics
Environment
Management System and Certification
Energy Management and Conservation
Water Reclamation
Green Facility
Sustainable Manufacturing
Green Bond
Employee
Human Rights Management
Employee Care
Employee Development
Employee Health and Safety
Supply Chain
Supplier Sustainability Management
Supplier Awards
Conflict Minerals Compliance
Social Involvement
Environmental Conservation
Industry-Academic Collaboration
Community Engagement
Public Advocacy
About ASE
Company Info
Milestones
Awards
Turnkey Services
Careers at ASE
Downloads
Press Center
Press Room
Events
Blog
Supply Chain
Management
Development
Supplier Self-recommendation
IP & Trademarks
Intellectual Property
ASE Trademarks
Contact Us
Manufacturing Facilities Overview
Plants & Offices Contacts
Sales, Media, CSR Contacts

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