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English 中文
Technology
System-in-Package
SiP Intelligent Design
Heterogeneous Integration
Antenna in Package
2.5D & 3D
TSV Interposer
Fan Out Packaging
Embedded Die Technology
FOCOS
MEMS & Sensors Packaging
Wafer Level Mems
Assembly
Flip Chip
Flip Chip CSP
Flip Chip BGA
FCBGA
FCCSP
HP Flip Chip BGA
Cu Pilliar
Solder Bumping
Wire Bond BGA
PBGA
HSBGA
FBGA
Leadframe
QFN
aQFN
QFP
LQFP/TQFP
PLCC
SO
PDIP
Wafer Level
aCSP/WLCSP
aWLP
WL IPD
WL MEMS
Substrate & Services
Packaging Substrate
Substrate Design
PBGA Substrate
BOC Substrate
Memory Card Substrate
Module Substrate
a-S3 Substrate
Advanced Substrate
Lab Service
Electrical
Material
Stress and Thermal
Chemical and Green
Failure Analysis
Optical
E-service
Bumping Service
Test Service
Test Service Offerings
Semiconductor Test
Tray Service
Tray Service Offerings
Investor Relations
Shareholder Services
Annual Reports
Dividends History
Shareholders' Meeting
Financials
Monthly Revenues
Quarterly Results
Financial Reports
Stock Exchange Filings
XBRL Files
Corporate Governance
Board of Directors
Corporate Governance Comparison
Conflict Minerals Compliance
Events & News
IR Events
IR News
FAQ
Sustainability
Governance
Corporate Sustainability Policy
Regulatory Compliance and Risk Management
Business Conduct and Ethics
Environment
Management System and Certification
The Building of Smart Grid
Water Reclamation
Green Facility
Sustainable Manufacturing
Green Bond
Employee
Human Rights Management
Employee Care
Employee Development
Employee Health and Safety
Supply Chain
Supplier Sustainability Management
Supplier Awards
Conflict Minerals Compliance
Social Involvement
Environmental Conservation
Industry-Academic Collaboration
Community Engagement
Public Advocacy
About ASE
Company Info
Milestones
Awards
Turnkey Services
Careers at ASE
Downloads
Press Center
Press Room
Events
Supply Chain
Management
Development
Supplier Self-recommendation
IP & Trademarks
Intellectual Property
ASE Trademarks
Contact Us
Manufacturing Facilities Overview
Plants & Offices Contacts
Sales, Media, CSR Contacts
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Failure Analysis Lab

Measurement

  • Encapsulant: Incomplete fill/Wire sweep/Warpage/Delamination/Void
  • Substrates: Warpage/Contamination/Crack
  • Flux: Flux residue/Outgassing/Corrosion
  • Leadframe: Contamination
  • TSV: Delamination/Crack/Void/Non-protrusion
  • Interposer: Delamination/RDL bridge/Contamination
  • Micro-bump: Crack/Void/Cold joint/Bridge

Reliability

Non-Destructive Analysis
Electrical Test TDR、Probing station、Curve tracer、DCT
Inspection Analysis OM、X-ray、SAT、Hi-resolution OM、IR-OM
Surface Analysis EDX
Structure Analysis W-SEM、FE-SEM、Table SEM
Failure Localization Lock-in thermography、OBIRCH

Destructive Analysis
Structure Analysis X-section、FIB、TEM、P-FIB
Surface Etch/Treatment Ion miller、PECS、FIB

Non-Destructive Analysis

  • Non-destructive analysis is the first step of failure analysis.
  • There are the technologies to detect the defects without damaging samples and which including two parts.
  • One is electrical test and the other is failure observation and localization. Electrical testing machines are function test, O/S test, curve tracer and so on.
  • The failure observation toolings are HR-OM, IR OM, X-ray, SAT, etc
  • The failure localization toolings are TDR, OBIRCH, thermal lock-in, etc.

Destructive Analysis

  • After non-destructive analysis, the defect location will be definition.
  • The destructive samples preparations before observation are also call destructive analysis.
  • The most common uses are cross-section, ion milling, PECS, FIB, and etc.
  • Furthermore, SEM, EDX, XPS and ESCA could observe the failure or the defects.

Electrical Lab
Material Lab
Stress & Thermal Lab
Chemical & Green
Technology Lab
Failure Analysis Lab
Optical Lab

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