Failure Analysis Lab
Measurement
- Encapsulant: Incomplete fill/Wire sweep/Warpage/Delamination/Void
- Substrates: Warpage/Contamination/Crack
- Flux: Flux residue/Outgassing/Corrosion
- Leadframe: Contamination
- TSV: Delamination/Crack/Void/Non-protrusion
- Interposer: Delamination/RDL bridge/Contamination
- Micro-bump: Crack/Void/Cold joint/Bridge