Failure Analysis Lab
Encapsulant: Incomplete fill/Wire sweep/Warpage/Delamination/Void
Flux: Flux residue/Outgassing/Corrosion
Interposer: Delamination/RDL bridge/Contamination
Micro-bump: Crack/Void/Cold joint/Bridge
TDR、Probing station、Curve tracer、DCT
Non-destructive analysis is the first step of failure analysis.
There are the technologies to detect the defects without damaging samples and which including two parts.
One is electrical test and the other is failure observation and localization. Electrical testing machines are function test, O/S test, curve tracer and so on.
The failure observation toolings are HR-OM, IR OM, X-ray, SAT, etc
The failure localization toolings are TDR, OBIRCH, thermal lock-in, etc.
After non-destructive analysis, the defect location will be definition.
The destructive samples preparations before observation are also call destructive analysis.
The most common uses are cross-section, ion milling, PECS, FIB, and etc.
Furthermore, SEM, EDX, XPS and ESCA could observe the failure or the defects.