Failure Analysis Lab

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Failure Analysis Lab

Measurement

Encapsulant: Incomplete fill/Wire sweep/Warpage/Delamination/Void
Substrates: Warpage/Contamination/Crack
Flux: Flux residue/Outgassing/Corrosion
Leadframe: Contamination
TSV: Delamination/Crack/Void/Non-protrusion
Interposer: Delamination/RDL bridge/Contamination
Micro-bump: Crack/Void/Cold joint/Bridge

Reliability

	Non-Destructive Analysis
Electrical Test	TDR、Probing station、Curve tracer、DCT
Inspection Analysis	OM、X-ray、SAT、Hi-resolution OM、IR-OM
Surface Analysis	EDX
Structure Analysis	W-SEM、FE-SEM、Table SEM
Failure Localization	Lock-in thermography、OBIRCH

	Destructive Analysis
Structure Analysis	X-section、FIB、TEM、P-FIB
Surface Etch/Treatment	Ion miller、PECS、FIB

Non-Destructive Analysis

Non-destructive analysis is the first step of failure analysis.
There are the technologies to detect the defects without damaging samples and which including two parts.
One is electrical test and the other is failure observation and localization. Electrical testing machines are function test, O/S test, curve tracer and so on.
The failure observation toolings are HR-OM, IR OM, X-ray, SAT, etc
The failure localization toolings are TDR, OBIRCH, thermal lock-in, etc.

Destructive Analysis

After non-destructive analysis, the defect location will be definition.
The destructive samples preparations before observation are also call destructive analysis.
The most common uses are cross-section, ion milling, PECS, FIB, and etc.
Furthermore, SEM, EDX, XPS and ESCA could observe the failure or the defects.

Electrical Lab

Material Lab

Stress & Thermal Lab

Chemical & Green
Technology Lab

Failure Analysis Lab

Optical Lab

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