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English 中文
Capabilities
Advanced Technologies
System-in-Package
Heterogeneous Integration
2.5D & 3D
Fan Out Packaging
Embedded Die Substrate
MEMS & Sensors Packaging
Antenna in Package
FOCoS
IC Packaging
Flip Chip Packaging
Wire Bond BGA
Leadframe Packaging
Wafer Level Packaging
Others
Packaging Substrate
Substrate Design
Package Design
Bumping Service
Tray Service
Test Service
Applications
Smart Living
Smart Bike
Smart City
Smart Automotive
Smart Factory
Investor Relations
Shareholder Services
Annual Reports
Dividends History
Shareholders' Meeting
Financials
Monthly Revenues
Quarterly Results
Financial Reports
Stock Exchange Filings
XBRL Files
Corporate Governance
Board of Directors
Corporate Governance Comparison
Conflict Minerals Compliance
Events & News
IR Events
IR News
FAQ
Sustainability
Governance
Corporate Sustainability Policy
Regulatory Compliance and Risk Management
Business Conduct and Ethics
Environment
Management System and Certification
Energy Management and Conservation
Water Reclamation
Green Facility
Sustainable Manufacturing
Green Bond
Employee
Human Rights Management
Employee Care
Employee Development
Employee Health and Safety
Supply Chain
Supplier Sustainability Management
Supplier Awards
Conflict Minerals Compliance
Social Involvement
Environmental Conservation
Industry-Academic Collaboration
Community Engagement
Public Advocacy
About ASE
Company Info
Milestones
Awards
Turnkey Services
Careers at ASE
Downloads
Press Center
Press Room
Events
Blog
Supply Chain
Management
Development
Supplier Self-recommendation
IP & Trademarks
Intellectual Property
ASE Trademarks
Contact Us
Manufacturing Facilities Overview
Plants & Offices Contacts
Sales, Media, CSR Contacts

Failure Analysis Lab

Measurement

  • Encapsulant: Incomplete fill/Wire sweep/Warpage/Delamination/Void
  • Substrates: Warpage/Contamination/Crack
  • Flux: Flux residue/Outgassing/Corrosion
  • Leadframe: Contamination
  • TSV: Delamination/Crack/Void/Non-protrusion
  • Interposer: Delamination/RDL bridge/Contamination
  • Micro-bump: Crack/Void/Cold joint/Bridge

Reliability

Non-Destructive Analysis
Electrical Test TDR、Probing station、Curve tracer、DCT
Inspection Analysis OM、X-ray、SAT、Hi-resolution OM、IR-OM
Surface Analysis EDX
Structure Analysis W-SEM、FE-SEM、Table SEM
Failure Localization Lock-in thermography、OBIRCH

Destructive Analysis
Structure Analysis X-section、FIB、TEM、P-FIB
Surface Etch/Treatment Ion miller、PECS、FIB

Non-Destructive Analysis

  • Non-destructive analysis is the first step of failure analysis.
  • There are the technologies to detect the defects without damaging samples and which including two parts.
  • One is electrical test and the other is failure observation and localization. Electrical testing machines are function test, O/S test, curve tracer and so on.
  • The failure observation toolings are HR-OM, IR OM, X-ray, SAT, etc
  • The failure localization toolings are TDR, OBIRCH, thermal lock-in, etc.

Destructive Analysis

  • After non-destructive analysis, the defect location will be definition.
  • The destructive samples preparations before observation are also call destructive analysis.
  • The most common uses are cross-section, ion milling, PECS, FIB, and etc.
  • Furthermore, SEM, EDX, XPS and ESCA could observe the failure or the defects.

Electrical Lab
Material Lab
Stress & Thermal Lab
Chemical & Green
Technology Lab
Failure Analysis Lab
Optical Lab

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