Failure Analysis Lab

	Non-Destructive Analysis
Electrical Test	TDR、Probing station、Curve tracer、DCT
Inspection Analysis	OM、X-ray、SAT、Hi-resolution OM、IR-OM
Surface Analysis	EDX
Structure Analysis	W-SEM、FE-SEM、Table SEM
Failure Localization	Lock-in thermography、OBIRCH

	Destructive Analysis
Structure Analysis	X-section、FIB、TEM、P-FIB
Surface Etch/Treatment	Ion miller、PECS、FIB

Non-destructive analysis is the first step of failure analysis.
There are the technologies to detect the defects without damaging samples and which including two parts.
One is electrical test and the other is failure observation and localization. Electrical testing machines are function test, O/S test, curve tracer and so on.
The failure observation toolings are HR-OM, IR OM, X-ray, SAT, etc
The failure localization toolings are TDR, OBIRCH, thermal lock-in, etc.

After non-destructive analysis, the defect location will be definition.
The destructive samples preparations before observation are also call destructive analysis.
The most common uses are cross-section, ion milling, PECS, FIB, and etc.
Furthermore, SEM, EDX, XPS and ESCA could observe the failure or the defects.