ASE Receives 2018 Taiwan Corporate Sustainability Award
The award is one of the highest levels of recognition given to companies that promote sustainable development and responsible investment
Taipei, Taiwan, November 22, 2018. Advanced Semiconductor Engineering, Inc. (ASE), the leading provider of semiconductor packaging, system-in-package technologies and test services, and a member of ASE Technology Holding Co., Ltd. (TAIEX: 3711, NYSE: ASX) today announced that it has received the Taiwan Corporate Sustainability Award (TCSA) for the following categories:
- Taiwan Top 50 Corporate Sustainability Report – Platinum
- Corporate Sustainability Report – English edition
- Top 50 Sustainable Corporations in Corporate Comprehensive Performance
- Climate Leadership
- Supply Chain Management
- Social Inclusion
The TCSA is popularly known as the ‘Oscars’ of Taiwan’s top sustainable corporations that had demonstrated high levels of transparency, gained stakeholder and employee trust, while building solid foundations for future progress towards sustainable development. Since 2014, ASE had undergone a major transformation in sustainable governance that saw the company developing sustainability as a corporate vision and integrating long term strategies with its daily operations and collaborating with business partners on corporate social responsibility.
ASE received the awards at the Global Corporate Sustainability Forum held on November 22, 2018 at the Grand Hotel Taipei. For more information, please refer to the relevant links about the TCSA awards, https://tcsaward.org.tw/en/main and ASE Corporate Sustainability, http://ase.aseglobal.com/en/CSR
About ASE Technology Holding Co Limited
ASE Technology Holding Co Limited is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, ASE develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services. For more information about ASE Technology, visit www.aseglobal.com.