English 中文


ASE provides the most complete, fully integrated semiconductor backend service in the industry, including - Assembly, Testing, and Material services. This enables our customers to conduct total cost management and enjoy greater flexibility in both forward and backward integration.

The extensive array of products and services we provide allow our customers to choose the IC package best suited to both their needs and the rigorous market requirements.

Assembly Offerings

ASE, among the leading IC packaging companies in the world, provides versatile, reliable and value-added services.

Test Service Offerings

ASE provides a complete range of semiconductor testing services that are among the most advanced in the semiconductor industry.

Material Offerings

ASE has focused on the research and development of substrate technology for the next generation IC package solutions.

This website uses Cookies to optimize your experience. By choosing to continue, you agree to the use of Cookies and our Cookie Term. To know more Cookies information as to how to enable and disable cookies, please see “How to change Cookies preferences or disable Cookies?” in our Cookie Term.

Accept Cookies