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Plastic Leaded Chip Carrier (PLCC) is widely used in micro-controllers and consumer electronics. Each lead of the PLCC is formed into a "J"-shape and folded under the package body. ASE provides PLCC packaging services in compliance with JEDEC standard. Lead count ranges from 20 to 84 with 1.27mm (50mil) lead pitch.


ASE's PLCC product was designed in compliance with JEDEC standard for 'J' shape leaded SMT packages. Its robust leads and smaller foot space makes it applicable for surface mount and replaceable plug-in assembly via sockets.

Design applications include,

  • Memory, Processors and Controllers
  • ASIC, DSP, PC Chipset Device for Consumer Products, Automotive and Aerospace

  • 453~1153mils body sizes
  • 28~84 available lead counts
  • JEDEC standard compliant
  • Wide selection of pad size to die size
  • High conductivity lead frame
  • Wide selection of pad size to meet die size per customized lead frame design capability
  • Pb-free process ready and available

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