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SO

SO (Small Outline) packages have been an industry standard for many years and the applications are common in consumer products, automotive devices, memory, analog ICs, and microcontrollers. SO packages have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance. Using SMT (Surface Mount Technology) assembly, SO packages provide an assortment of packaging capabilities, especially in low pin count devices at competitive manufacturing costs. SO packages consist of SOP/SSOP and SOJ.

The features of Small Outline Package (SOP) are similar to SOJ, except that the leads' end is formed in the shape of a gull-wing. SSOP is the shrunk version of SOP, with lead pitch narrowed from 1.27mm (50mil) to 0.635mm (25mil). The shrunk body means flexible layout within finite PCB area. Another advantage is that shorter leads improve the electrical performance.

Application
Features

ASE's SOP/SSOP product was designed in compliance with JEDEC standards. Applications includes low pin count packages used in

  • Cellular Phones
  • Wireless LAN
  • Personal Digital Assistants
  • Digital Cameras
  • Video
  • Information Appliances

  • SOP body sizes 154 up to 450 mils
  • SSOP body sizes 300 mils
  • SOP lead counts available from 8 to 32
  • SSOP lead counts available 48 & 56
  • JEDEC standard outlines
  • Existing BOM and process flow
  • Pb-free process ready and available

Small Outline J-leaded (SOJ) package is similar to PDIP, but the leads' end are formed in a "J"-shape to be folded under the body. This aims to reduce the foot print. With the increasing popularity of SMT and with a smaller outline than PDIP, SOJ is widely used to complement PDIP.

Application
Features

Telecommunication Products
• Cellular Phone
• Wireless LAN

Portable Products
• Personal Digital Assistants
• Digital Cameras
• Audio/Video

Low Pin Count Packages
• Information Appliances

  • Low profiles and lightweight
  • Steady yield
  • Low cost
  • SOJ body sizes from 710 up to 1125 mils
  • Pb-free Process ready and available
  • JEDEC standard outlines
  • Existing BOM and process flow

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