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Sensor & Optical SiP Module

Application
Features
  • Physiological Signal Sensing
  • Structure: Optical molding + EDS
  • LED x 3pcs + photo-die x 1pcs W/B
  • EDF: 2L embedded-die substrate
  • Dimension: LGA 5.5x4.2mm²
  • Protection: Molding with clean CPD
Application
Features
  • Heart Rate Monitoring & Heart Rate Variability, SpO2, Skin Temperature, Blood Pressure
  • Handset, Wearables & Fitness
  • Integrated ARM-Cortex M4 MCU
  • Integrated 24bits AFE (Analog front-end) for optical sensing
  • Optical photo sensor with Red & IR & Green LED
  • Embedded motion cancellation algorithm &skin variation
  • Embedded die substrate: SESUB
  • Micro LENs molding, double molding
  • Lid open-cavity capping
Application
Features
  • Handset, Wearables, IoT
  • Smart Home & Building
  • Automotive, Industry
  • All-in-one SiP: Bluetooth v4.2 (BLE), ARM Cortex – M0 MCU
  • Temperature/Humidity/Pressure sensing
  • Package: open cavity WL SiP, TSV
Application
Features
  • Environment
  • Smart Home & Building
  • All-in-one SiP: Bluetooth v4.2 (BLE), ARM Cortex – M0 MCU
  • High resolution ADC for lighting channel (green/white/UV/IR)
  • Excellent UV sensibility
  • UV/ALS software for UV level & lighting control
  • Package: FOCSP, Micro LENs molding
Application
Features
  • Wearables, Fitness
  • Smart Home & Building
  • Industry
  • All-in-one SiP: Bluetooth v4.2 (BLE), ARM Cortex – M0 MCU
  • 3-axis acceleration sensor (range: 16G)
  • Embedded motion software for security detection
Application
Features
  • IAQ Monitoring for Smartphones, Accessories and Connected Home Devices
  • Alcohol Breathalyzer in Consumer Devices
  • Smart City
  • Air quality sensor
    CO2 (eCO2): from 400ppm TO 5000oom
    TVOC (the total volatile organic compound): from 0ppb to 1000ppb
    Dimension: 4x2.7x1.1mm
  • Temperature/Humidity/Pressure sensing
  • Package: Open cavity WL SiP, TSV
Application
Features
  • Handset, Wearables, IoT
  • Smart Home & Building, Hospital
  • Automotive
  • All-in-one SiP: Bluetooth v4.2 (BLE), ARM Cortex – M0 MCU
  • R transmitter/receiver
  • Embedded gesture software for application control
  • Package: MEMS, TSV, Optical, IR sensing, cavity, selective molding
Application
Features
Magnetic sensor
  • Magnetic Temper Detection
IR sensor
  • Stationary Human Detection
  • Sunlight & Motion Detection
Magnetic sensor
  • 16 bit data out for each magnetic component
  • Dimension: 3.0x3.0x0.75mm
  • Package: MEMS, TSV
IR sensor
  • Quantum-type with four IR elements
  • Dimension: 4.6x3.8x1.9mm

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