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aWLP has higher I/O than wafer level package. It is a substrate-less solution with small form factor, improved electrical and thermal performance. aWLP is a die down fan out wafer level package with molding compound surrounded, ideally designed for communication devices with constrained space.

  • Baseband
  • RF
  • Codec
  • PMICs
  • Car Radar
  • Improved electrical and thermal performance
  • Die down FOWLP with molding compound surrounded
  • Single die package & 2 dies (side-by-side) embedded structure approached
  • Finer line width/space = 2/4um
  • 3 layers RDLs approached (min.)
  • Support package size up to 10 x 10mm (max.)

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