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Packaging Substrate

Developments in the IC industry have triggered the rapid growth of the computing, communications and consumer electronics market in the last decade. Recently, the outsourcing trend has thrived in semiconductor backend services and the substrate business is a necessary complement to the assembly service of ICs. Continuing the momentum, ASE Group has focused on the research and development of substrate technology for low cost, high performance, thin, miniature, reliable and environmentally compatible next generation IC package solutions.

We expect substrates will become an increasingly important value-added component of the semiconductor packaging business. The demand for higher performance semiconductors in smaller packages will continue to spur the development of advanced substrates that can support the advancement in circuit design and fabrication. As a result, we believe that the market for substrates will grow and the cost of substrates as a percentage of the total packaging process is getting more significant, especially for advanced packages such as flip-chip BGA packages.


We leverage the expertise of ASE Group's capabilities to achieve integrated design by integrating the assembly technologies and substrate technologies as well as to provide our customers with reliable quality, cost effectiveness and fast cycle time. ASE well prepares in stable high volume manufacturing ability with consistently increasing capacity for customers' quick ramp up.

ASE's substrate design and manufacturing capability enables the interconnection materials of a wide range of wire-bond BGA and flip chip product applications. We also provide stub-less solution with etching back and GPP process for substrates for high frequency and high performance package applications.

We believe that interconnect technology and materials have become an increasingly value-added element for the semiconductor packaging business. Consequently, ASE continues to focus on developing and enhancing the in-house capability and capacity of substrate design and manufacturing to benefit our customers with our fast cycle time, largest capacity, mature technology and competitive price.

PBGA (Plastic Ball Grid Array) package consist of wire-bonded die on base substrate made up of glass fiber immersed resin copper clad laminate and encapsulate it by plastic (epoxy molding compound). ASE is capable of providing substrate suitable for high power and high speed package requiring enhanced thermal and electrical performance.

Application
Features
  • Microprocessors/Controllers
  • ASIC
  • Graphics and PC Chipsets
  • Gate Arrays
  • PLDs, DSPs
  • Memory Packages
  • Communications & Networking

Reliability

Item Condition/Duration
MST Level 3, 30°C/60% RH, 192 hrs
TCT -65ºC~150ºC, 1000 cycles/-55~125ºC,
HAST 130°C/85% RH, 33.5 psi 96 hrs
HTST 150°C, 500/1000 hrs

The BOC package was designed as a cost effective CSP solution specifically for high-frequency memory devices. The structure provides the shortest wire length and outstanding electrical performance for the central – pad device layout through the use of low-cost wire bonding and BGA technologies.

Application
Features

The BOC package is an ideal IC package for devices such as SDRAM, SGRAM, DDR SDRAM, RAMBUS DRAM and next-generation.

Reliability

Item Condition/Duration
MST Level 3, 30°C/60% RH, 192 hrs
TCT -65ºC~150ºC, 1000 cycles/-55~125ºC,
HAST 130°C/85% RH, 33.5 psi 96 hrs
HTST 150°C, 500/1000 hrs

Provide customers with cost effective and reliable quality substrate for memory cards used in variety of portable devices for data storage including SD (Secure Digital), mini SD and micro SD.

Application
Features

Memory cards are used as data storage for portable devices:

  • Cellphones, Tablets & Smart Phones
  • MP3 Players
  • Digital Cameras
  • PC/Notebook
  • PDA

Reliability

Item Condition/Duration
MST Level 3, 30°C/60% RH, 192 hrs
TCT -65ºC~150ºC, 1000 cycles/-55~125ºC,
HAST 130°C/85% RH, 33.5 psi 96 hrs
HTST 150°C, 500/1000 hrs

In a vast and rapid changing world of technology, demands in semiconductor devices continuously increased over the years. Compact size, light weight and cost effective are put into consideration. With these demands ASE progressively continues on developing advanced, high end and sophisticated substrate materials with more complex and rigid designs. In line with this is the development of module substrates. A substrate that interconnects between the integration of multiple devices in one package. It is a combination of active and passive devices. With these developments ASE unceasingly innovates and leads substrate package solution and adapts to the rapid changing world of technology, meeting costumers’ demands, expectations and satisfactions.

Application
Features

Wireless devices: Wireless modules on smart phones and tablet PC’s

Reliability

Item Condition/Duration
Pre-Condition SAT(T=0) → Bake 125℃, 24hrs → Soaking 30℃/60%, 192hrs → Reflow 260℃/3 cycles
TCT -60℃~150℃/850 cycles
UHAST 130℃/85%, 96hrs
UTHB 85℃/85%, 1000hrs
HTST Bake 150℃, 1000hrs
PCT 121℃/100%, 168hrs

Substrate is made by single side build-up flow.

Application
Features
  • Application Processor
  • Networking
  • Connectivity
Item Condition/Duration
MSL JEDEC Level 3, 30°C/60%RH, 192 hours
PCT 121°C/100% RH/2 atm, 168 hours
TCT -65°C ~150°C, 1000 cycles
HAST 130°C /85%RH/33.5 PSIA, 96 hours
HTST 150, 1000 hours

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