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Advanced Substrate

With an expansive substrate portfolio, ASEE enables our customers to select the materials that best meets their device and budget requirements. From flip chip to wire bond substrates, ASEE combines the technology, the technical support, and the world-class customer service that give customers the competitive advantage they need to lead the industry.

ASEE has invested substantially in research and development for these enabling technologies.

a-S3 PRO

  • Single layer substrate for routable QFN application
  • Very thin substrate
  • Flexible pattern design
  • Cost effective solution

1L ETS

  • Very thin substrate & advanced pattern design
  • Same process flow in assembly (even though thin substrate)
  • Cost effective fan-out solution

0.5L+

  • Wide assembly operation window for fine I/O pitch
  • Good coplanarity on extended bump pad
  • Fine pattern capability in embedded trace layer
  • Flexible design in bump-pad-to-trace space & in extended bump shape
  • Good warpage performance

EPP + EPS

  • Passives embedded in coreless substrate
  • Fine pattern capability in embedded trace layer
  • Double-side interconnection for flexible design
  • Good electrical performance

Cu Pillar Substrate

  • Organic interposer for PoP package
  • Substrate process with standard panel format
  • Thin substrate with sufficient pillar height
  • Cost effective, alternative to silicon interposer

Cavity Substrate

  • Package thickness reduction
  • Flexible design on cavity depth & quantity
  • Substrate process with standard panel format

a-S3 PRO

  • Bendable thin substrate
  • Advanced pattern design
  • Wearable application

Embedded Passives Substrate (EPS)

  • Passives embedded in coreless substrate
  • Fine pattern capability in embedded trace layer
  • Double-side interconnection for flexible design
  • Good electrical performance & small form factor
  • Cost effective solution

Embedded Dies Substrate (EDS)

  • Panel format to form fan-out package
  • Fine I/O pitch & thin package profile
  • Shielding function & good thermal performance
  • 6-side protection to avoid die chipping

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