In a vast and rapid changing world of technology, demands in semiconductor devices continuously increased over the years. Compact size, light weight and cost effective are put into consideration. With these demands ASE progressively continues on developing advanced, high end and sophisticated substrate materials with more complex and rigid designs. In line with this is the development of module substrates. A substrate that interconnects between the integration of multiple devices in one package. It is a combination of active and passive devices. With these developments ASE unceasingly innovates and leads substrate package solution and adapts to the rapid changing world of technology, meeting costumers’ demands, expectations and satisfactions.