Amplifying the Future of Smart Hearables with ASE System-in-Package Solutions
The ubiquitous earphones have become a high tech necessity in the digital era, connecting us to our smart phones, computers, gaming consoles, TVs and much more. With the rise of IoT (internet-of-things), earphones have advanced from just a device for listening to music and making phone calls, to connecting intelligently with other smart devices by transmitting data to make life more comfortable. Technologies that integrate these functions include TWS (true wireless stereo) that uses Bluetooth signals to transfer sound, and biometric sensors. Designing modern hearing aids including earbuds come with various challenges due to the small real estate space of the device. Meanwhile, the chip industry is constantly looking for cost-effective solutions that will reduce noise and cross talk, and increase performance.
Miniaturization, Optimization, Simplification
At ASE, we offer a suite of SiP (System-in-package) solutions that help customers improve their manufacturing yield and quality, ensure ultimate functional reliability of their end products, and accelerate time-to-market.
Customers leverage on the ASE advantage for supreme smart hearable designs through our expertise in SiP technology to:
- deliver pristine sound quality
- optimize RF technology for seamless wireless connection
- integrate more sensors and chip functions
- incorporate waterproof and noise cancellation features
- enable miniaturization
We offer customers a customizable open source module platform comprising a SiP reference design, a SiP development module and sensor module integration to address electrical design challenges and support the integration of multiple microphones and chip functions. Our platform also has the flexibility to allow the heterogeneous integration of single or multiple chips (for example, special purpose processors, DRAM, flash memory), surface mount devices (SMDs), filters, MEMS, sensors and other active/passive components and pre-assembled packages or subsystems for heterogeneous integration.
Detailed ASE Reference Designs for Hearing Aid Products
TWS/Hearing device platform
Open Source Modules
- SiP Reference Design
- SiP Development Module
- Sensor Module Integration Design
Product Application Design
- TWS/Hearable Product Designs
- Gaming earphones
- Motion sensors
- Electronic Stethoscopes
- Wearable Health and Monitoring Devices
Introducing the ASE ATOM Earbud
To demonstrate the efficacy of ASE’s SiP platform, we created an ASE Atom earbud through 3D printing. The ASE Atom features electro-acoustic components, a bottom ID (industrial design), battery, PCB board, microphone with antenna bracket and a top ID. Through a simplified SiP design and an optimized hardware layout that combine components such as IMUx6 axis sensors, antennas and microphones, an engineer would be able to assemble a piece of earbud in just 2 minutes 42 seconds. The solution platform allows us to maintain an extremely small formfactor despite integrating many different chips and sensors. It also enables the standardization of passive component design rules, while achieving miniaturization and optimizing the performance.
In addition, different housing designs and sound processing algorithms provide different levels of performance standards and ANC (Active Noise Cancellation). A wide range of TWS earbuds or hearing devices can be designed to meet specifications of 2Mic and 20dB (earbuds), 1Mic and 45dB (hearing aids), and 2Mic and 45dB (hearing aids).