Smart Automotive | ASE

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Smart Automotive

ASE’s semiconductor packaging and test technology is enabling new generations of smart vehicles with higher levels of safety, comfort and convenience. The automotive market is also moving away from gas guzzling and air polluting vehicles, to more energy efficient electric vehicles. We are working closely with automotive customers to integrate packaging technologies into sensors - image sensors, environment sensors and controllers to manufacture chips that can intelligently learn, analyze and communicate information to perform different functions and save energy.

We provide a comprehensive one-stop manufacturing service from wafers to packages to modules, and offer cost effective turnkey solutions for rapid time-to-market. We have long-term partnerships with global tier-one automotive suppliers and most of our sites are TS16949, ISO26262 and ISO/SAE 21434 certified. Explore our suite of products and services that will power your automotive applications with higher reliability, integration and efficiency.

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Airbag Control
Airbag – Facial Recognition
Side Airbag Sensor
Anti-lock
Electronic Stability Control
TPMS
LiDAR
Radar
Finger Print Sensor
Crash Sensor
Active Suspension
Ultrasonic Sensor
Engine Oil Pressure
Seat Occupant Sensor
Speed from Tire Rotation
Night Vision
Camera – Driver Monitoring, Collision Detection, Sign Reading

Leadframe
Wafer Level
MEMS & Sensors
Module
Advanced
IMU

ADAS Control Module
LiDAR
Radar
Electronic Stability Control
Ultrasonic
Active Suspension
Night Vision
AI Co-pilot
AI Cockpit
Camera – Driver Monitoring, Collision Detection, Sign Reading

Leadframe
Wire Bond
Flip Chip
MEMS & Sensors
Module
Advanced
IMU

Climate Control
Ultrasonic
LiDAR
Radar
VOC, Alcohol Sensor
Engine Oil Pressure
Electronic Stability Control
Side Airbag
Seat Occupant Sensor
Humidity & Temperature Sensor
Camera – Driver Monitoring, Collision Detection, Sign Reading

Leadframe
Wire Bond
MEMS & Sensors
Module
Advanced
IMU

Fixed Navigation Systems
Audio Head Units
Infotainment Head Units
Rear Seat Entertainment
Seat Occupant Sensor
VOC, Alcohol Sensor
Display Control for Map – Proximity & Gesture

Leadframe
Wire Bond
Wafer Level
MEMS & Sensors
Module
Advanced
Flip Chip

Tire Pressure Monitoring
Electronic Stability ControlEngine Oil Pressure
Steering
Anti-lock Braking
Active Suspension
Speed from Tire Rotation
Brake/Accelerator Pedals

Leadframe
Wire Bond
Wafer Level
MEMS & Sensors
Module
Advanced
IMU

Electric Drive Controller
Electronic Stability Control
Air Intake
Battery Management
Active Suspension
Inverter
EV Charging Station

Leadframe
Wire Bond
MEMS & Sensors
Module
Advanced
IMU
IGBT+Coupler

Instrumentation

Head-up Display
Display Dimming
Finger Print Sensor
Instrument Cluster
Display Control for Map – Proximity & Gesture
Camera – Driver Monitoring, Collision Detection, Sign Reading
Finger Print Sensor
Voice Control
Noise Cancellation
Night Vision

Wire Bond
Wafer Level
Flip Chip
MEMS & Sensors
Module
Advanced

Engine Control Module
Transmission Control Module
Diesel Engine Exhaust gas recirculation (EGR)
Engine Oil Pressure
Air Intake
Electronic Stability Control

Leadframe
Wire Bond
MEMS & Sensors
Module
Advanced
IMU

Portable Navigation Devices
Video Recorders
Audio Head Units
Rain Sensor
Infotainment Head Unit
Head-up Display
VOC, Alcohol Sensor
Airbag – Facial Recognition
Camera – Driver Monitoring, Collision Detection, Sign Reading

Leadframe
Wire Bond
Flip Chip
MEMS & Sensors
Module
Advanced

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