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Smart Automotive

ASE’s semiconductor packaging and test technology is enabling new generations of smart vehicles with higher levels of safety, comfort and convenience. The automotive market is also moving away from gas guzzling and air polluting vehicles, to more energy efficient electric vehicles. We are working closely with automotive customers to integrate packaging technologies into sensors - image sensors, environment sensors and controllers to manufacture chips that can intelligently learn, analyze and communicate information to perform different functions and save energy.

We provide a comprehensive one-stop manufacturing service from wafers to packages to modules, and offer cost effective turnkey solutions for rapid time-to-market. We have long-term partnerships with global tier-one automotive suppliers and most of our sites are TS16949 and ISO26262 certified. Explore our suite of products and services that will power your automotive applications with higher reliability, integration and efficiency.

  • Airbag Control Module
  • Airbag Crash Sensors
  • Event Data Recorder

  • Leadframe

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • ADAS Control Module
  • Camera Modules
  • Sensor Modules
  • V2X Communications

  • Leadframe

  • Wire Bond

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Climate Control
  • Remote Keyless Entry System
  • Lighting
  • Electronic Control Units

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Audio Head Units
  • Fixed Navigation Systems
  • Infotainment Head Units
  • Rear Seat Entertainment

  • Leadframe

  • Wire Bond

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced
  • Antilock Braking System (ABS)
  • Stability Control
  • Tire Pressure Monitoring
  • Steer/Brake-by-wire

  • Leadframe

  • Wire Bond

  • Wafer Level

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Electric Drive Controller
  • Battery Management
  • Inverter

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU

  • IGBT+Coupler
  • Instrument Cluster
  • Head-up Display

  • Wire Bond

  • Wafer Level

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced
  • Engine Control Module
  • Transmission Control Module

  • Leadframe

  • Wire Bond

  • MEMS & Sensors

  • Module

  • Advanced

  • IMU
  • Portable Navigation Devices
  • Audio Head Units
  • Infotainment Head Units
  • Video Recorders

  • Leadframe

  • Wire Bond

  • Flip Chip

  • MEMS & Sensors

  • Module

  • Advanced

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