Flip Chip Organic BGA
Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA package especially in high frequency applications.
Flip Chip Ceramic BGA
Alumina ceramic substrate offers better moisture resistance, electrical insulating property and higher thermal conductivity than organic substrate. FCBGA is used primarily for high-reliability commercial applications (e.g. CPU).
|Test Item||Reference Standard||Condition/Duration|
|MSL||JEDEC 22-A113||Level 3, 30°C/60% RH, 192 hrs|
|TCT||JEDEC 22-A104-B||-65°C to 150°C, 500/1000 cycles|
|THT||JEDEC 22-A101||85°C/85% RH, 500/1000 hrs|
|HAST||JEDEC 22-A118||130°C/85% RH, 33.5psi, 50/100 hrs|
|HTST||JEDEC 22-A103-B||150°C, 500/1000 hrs|
|PCT||JEDEC 22-A102||121°C/100% RH, 15psig, 96/168 hrs|