With leadership in test technologies through a broad variety of test platforms, ASE Group provides a complete range of semiconductor test services to our customers, including front-end engineering test; wafer probing; final test of logic, mixed signal, RF, SLT (System Level Test) and memory semiconductors; and other test-related services encompassing burn-in test, dry-pack, and tape and reel. Our test services employ technology and expertise and are the most advanced in the semiconductor industry.
In addition to our huge capacity of test equipment enabling quick ramp-up to our customers' requirements, ASE is outstanding in multi-functional test with expertise in test platforms, program conversion and test program development, empowering SoC/MCM/SiP testing technology to meet the increasing need to pack more functions onto a single chip or a package.
Engineering Development Procedure & Production Value Added
Our excellent test capabilities in chipset, graphics, embedded DRAM/MCM, CPU, RF, analog, analog to digital/digital to analog, and digital signal processors makes ASE an effective test solution provider, offering rapid time to market and cost effective solutions.