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NEWS
2018 / 11 / 22

ASE Receives 2018 Taiwan Corporate Sustainability Award

The award is one of the highest levels of recognition given to companies that promote sustainable development and responsible investment

Taipei, Taiwan, November 22, 2018. Advanced Semiconductor Engineering, Inc. (ASE), the leading provider of semiconductor packaging, system-in-package technologies and test services, and a member of ASE Technology Holding Co., Ltd. (TAIEX: 3711, NYSE: ASX) today announced that it has received the Taiwan Corporate Sustainability Award (TCSA) for the following categories:

  • Taiwan Top 50 Corporate Sustainability Report – Platinum
  • Corporate Sustainability Report – English edition
  • Top 50 Sustainable Corporations in Corporate Comprehensive Performance
  • Climate Leadership
  • Supply Chain Management
  • Social Inclusion

The TCSA is popularly known as the ‘Oscars’ of Taiwan’s top sustainable corporations that had demonstrated high levels of transparency, gained stakeholder and employee trust, while building solid foundations for future progress towards sustainable development. Since 2014, ASE had undergone a major transformation in sustainable governance that saw the company developing sustainability as a corporate vision and integrating long term strategies with its daily operations and collaborating with business partners on corporate social responsibility.

ASE received the awards at the Global Corporate Sustainability Forum held on November 22, 2018 at the Grand Hotel Taipei. For more information, please refer to the relevant links about the TCSA awards, https://tcsaward.org.tw/en/main and ASE Corporate Sustainability, http://ase.aseglobal.com/en/CSR


 

About ASE, Inc.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more. To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: ASE Website , or follow us on LinkedIn & X: @aseglobal.