Press Room
ASE Receives 2018 Taiwan Corporate Sustainability Award
The award is one of the highest levels of recognition given to companies that promote sustainable development and responsible investment
Taipei, Taiwan, November 22, 2018. Advanced Semiconductor Engineering, Inc. (ASE), the leading provider of semiconductor packaging, system-in-package technologies and test services, and a member of ASE Technology Holding Co., Ltd. (TAIEX: 3711, NYSE: ASX) today announced that it has received the Taiwan Corporate Sustainability Award (TCSA) for the following categories:
- Taiwan Top 50 Corporate Sustainability Report – Platinum
- Corporate Sustainability Report – English edition
- Top 50 Sustainable Corporations in Corporate Comprehensive Performance
- Climate Leadership
- Supply Chain Management
- Social Inclusion
The TCSA is popularly known as the ‘Oscars’ of Taiwan’s top sustainable corporations that had demonstrated high levels of transparency, gained stakeholder and employee trust, while building solid foundations for future progress towards sustainable development. Since 2014, ASE had undergone a major transformation in sustainable governance that saw the company developing sustainability as a corporate vision and integrating long term strategies with its daily operations and collaborating with business partners on corporate social responsibility.
ASE received the awards at the Global Corporate Sustainability Forum held on November 22, 2018 at the Grand Hotel Taipei. For more information, please refer to the relevant links about the TCSA awards, https://tcsaward.org.tw/en/main and ASE Corporate Sustainability, http://ase.aseglobal.com/en/CSR
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on on LinkedIn and X: @aseglobal.
