Altera Qualifies ASE’s Lead-Free Packages
SANTA CLARA, Calif., February 24, 2003 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), one of the world’s largest semiconductor packaging and testing companies, announced that Altera Corporation (NASDAQ: ALTR) has qualified several lead-free packages at ASE that includes TQFP, LQFP, PQFP, LBGA (Altera’s Fineline BGA® packaging), and PLCC1. These packages are available in Altera’s lead-free packaging portfolio, which includes the StratixTM, Stratix GX, CycloneTM, and MAX® 3000A device families.
“Both Altera and ASE’s research and development teams successfully collaborated to achieve this milestone which enables us to offer our customers a wide array of lead-free packaging solutions for FPGAs and CPLDs2, ” said Vincent Wang, vice president of package technology at Altera.
For more information about Stratix, Stratix GX, Cyclone, and MAX 3000A device families, please visit http://www.altera.com/products/devices.
“ASE’s advancements in lead-free chip packaging aim to meet the stringent requirements of global environmental protection by eliminating the use of lead in the manufacturing of electronic products, ” said B.C. Chong, vice president of business development at ASE Electronics Malaysia. “We continue to work closely with customers to develop environmental-friendly chip packages that meet their precise package reliability for next generation ICs.”
The qualified lead-free packages are available at ASE’s leading edge facilities in Penang, Malaysia and Kaohsiung, Taiwan. For a list of ASE’s lead-free portfolio, please visit http://www.aseglobal.com or contact your nearest ASE sales office.
Altera, The Programmable Solutions Company, the stylized Altera logo , specific device designations, and all other words that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holder.
1 TQFP (Thin Quad Flat Pack), LQFP (Low profile QFP), PQFP (Plastic QFP), LBGA (Low profile BGA), PLCC (Plastic Leadless Chip Carrier)
2 FPGA (Field Programmable Gate Array), CPLD (Complex Programmable Logic Device)
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.