Press Room

2012 / 05 / 29

ASE Announces the Opening of Its Weihai Phase 3 Manufacturing Facility

Weihai, Shangdong, May 29th, 2012 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, today celebrated the official opening of its Phase 3 manufacturing facility in Weihai, Shangdong province, China. The new building is part of ASE’s expansion plans to increase its manufacturing capacity for discrete packaging and test.

The official opening ceremony was hosted by Dr. Tien Wu, chief operating officer of the ASE Group and J.H. Lee, general manager of ASE Weihai. The event was also graced by senior officials of Weihai city including Mr Tang Guan Yuan, vice mayor and Mr Zhang Jian Jun, director of the economic development zone. 

The new building occupies a land space of 5, 120 square meters with a built up floor space of 30, 560 square meters. ASE plans to recruit an additional 2, 000 employees in engineering, development and operations for the new facility. 

In 2008, ASE acquired the Weihai manufacturing facility from Aimhigh Corporation. The Weihai facility is focused on the packaging and testing of discrete semiconductor devices such as TO-92, Power and SOP/DFN which are widely used in automotive, consumer, computing, communications and industrial applications. Over the years, ASE has invested about $200 million on building expansion, equipment purchase, facility upgrading and R&D. 

According to Gartner, discrete semiconductor revenuesis $20.6 billion in 2011. ASE estimated that the amount spent on semiconductor packaging and test is approximately 

$6 billion.  With the advent of cloud computing and increased semiconductor content in various electronics applications, there is a significant opportunity for growth in discrete semiconductor manufacturing. ASE Weihai is fully committed to deliver a high standard of service, support and manufacturing capacity to meet these future demands from our customers. 


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on Twitter: @aseglobal.

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