ASE to Showcase System-in-Package and MEMS & Sensor Solutions through Smart Living Applications at COMPUTEX 2016
Show suite to demonstrate ASE SiP and sensors technologies for the IoT
Taipei, Taiwan, May 30, 2016 – Advanced Semiconductor Engineering, Inc (TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor assembly and test service provider, today announced that it will showcase System-in-Package (SiP) and MEMS & Sensor technologies through live demonstrations of Smart Living and Smart Bike applications at COMPUTEX 2016, scheduled to take place in Taipei, Taiwan, May 31 – June 3, 2016. These SiP and sensor applications highlight ASE’s innovative portfolio geared towards the IoT market, as well as the company’s continued commitment to environmental sustainability.
SiP technology is an ideal solution for a broad spectrum of consumer technology. With its ability to enable multiple semiconductor chips and passive components to be integrated within increasingly more compact modules, without compromising functionality, SiP is perfectly suited for IoT applications. During COMPUTEX, ASE will showcase ways in which SiP technology will enable the evolving Smart Living era. Booth visitors see live demonstrations featuring mesh lighting that can be controlled through an iPad, environmental sensors and home security systems. These demonstrations will feature the potential applications for these new technologies.
Additionally, visitors will be able to see a live Smart Bike demo in which ASE will showcase how its SiP platform can enable smart biking through a city. The demo will feature traffic light control optical sensing, motion sensing and heart rate and oxygen saturation detection, among other technologies. COMPUTEX attendees will find the Smart Living and Smart Bike demonstrations in the ASE VIP suite, which is located on the second floor of the Taipei International Convention Center (TICC), number T203A.
ASE’s advancements in SiP technology serve to meet growing market demand for low-powered controllers and sensors with small footprints but large memory for continually shrinking devices. Enabling heterogeneous integration of numerous IC functions — such as RF, processor, memory, sensors, power, multimedia and more — within very tight space constraints.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.