ASE holds groundbreaking ceremony for new green building in Kaohsiung
Building is part of ASE’s expansion plans on the research and development of advanced packaging technologies that will enable the market for the Internet-of-things
Kaohsiung, Taiwan, October 06, 2016 – Advanced Semiconductor Engineering, Inc (ASE, TAIEX: 2311, NYSE: ASX), the leading provider of semiconductor assembly and test services, today held a groundbreaking ceremony at the site of its K24 building in the Nantze Export Processing Phase 2 Zone in Kaohsiung, Taiwan. The building is part of ASE’s continued expansion plans for its research and development, and manufacturing campus in Taiwan.
The 66, 120 square meter K24 building will be the latest green building in ASE that incorporates green design in its construction with permeable pavement, stormwater management, earthquake proofing, energy-efficient lighting and ergo nomically constructed workspaces. K24 will be the benchmark for ASE’s future building and office designs and will promote a comfortable and more productive working environment for its employees.
The K24 facility will be one of ASE’s and the packaging industry’s core center of advanced development in IC packaging focusing on its leadership in system-in-package, 3D IC, fan-out wafer level packaging, system design and manufacturing technologies.
“To address the increasing market opportunity for internet-of-things, wearable and automotive technologies, smart homes and cities, ASE recognizes the need to step up its investment in people and technologies, ” says Raymond Lo, President and General Manager of ASE Kaohsiung. “The company will continue to expand its operations from its base in Kaohsiung and to make a significant and positive impact on the local economy, ” he continued.
ASE is committed to its social responsibility of hiring local talent and in the creation of higher value-added high-tech jobs. When completed, the new building will add more than 1800 employees in its R&D labs and manufacturing facility.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.