ASE introduces Multi-Package Ball Grid Array Technology
Taipei, Taiwan, October 25th, 2001 – Advanced Semiconductor Engineering, Inc, one of the world’s largest semiconductor packaging and testing companies, announced today the availability of its Multi-Package BGA technology.
MPBGA is an advanced package type of the MCM (Multi-Chip Module) package family. In MPBGA, the dies are first packaged, tested and then stacked or assembled. MPBGA utilizes only KGD (Known Go od Dies – dies that have been tested and are not shown to be defective) as opposed to traditional MCM package types which stack the dies first, then test the finished package. Hence, MPBGAs have an extreme low rate of package failure. Furthermore, as MPBGA is a single BGA package consisting of two or more packages, the area of the printed circuit board whereby the package will be assembled, can further be reduced. MPBGA is highly suitable for integrated graphics and memory chips; both of which require high speed and high performance capabilities.
Demand for miniaturization and increased functionality has brought SoC (System-on-a-Chip) and SiP (System-in-a-Package) technologies to the forefront of semiconductor developments. SoC, in particular, is seen as key to the development of next-generation digital communication products. However, SoC has yet to be commercially viable due to a high technology entry barrier, costly and lengthy development time and low production yields. In the meantime, MPBGA is seen to be a feasible alternative as it enables more chip functions to be integrated onto a package. This integration not only increases performance and allows miniaturization; it is also a lower-cost solution for customers desiring SoC-like qualities in their IC packages.
“As a leading packaging and testing company, ASE relentlessly invests in the research and development of advanced packaging technologies to support our customers’ demanding and diverse requirements, ” said J.J. Lee, vice president of R&D, ASE Group. “MPBGA is a stepping stone for the semiconductor industry’s transition from a single-function chip to system-on-a-chip.”
Today, ASE has completed the successful development of its MPBGA technology with samples already qualified by its customers in the second and third quarter of this year. Volume production will be launched this quarter with a monthly capacity of 100, 000 pieces.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.